Fixing Device Heating Member Thermal Expansion Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing fixing devices face challenges in securely attaching a heat source to a support portion due to restricted movement of the heat transfer member caused by adhesive, which hinders thermal expansion and stability during thermal expansion of the heat source.
Innovation Solution
A fixing device with a heat source, a support portion, and at least one adhesive layer that fixes the heat source and support portion together, along with a heat transfer member positioned elsewhere to conduct heat, allowing for stable attachment and thermal uniformity without restricting the heat transfer member's movement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the heat transfer member is bonded to the support portion with adhesive, then the heat transfer member is fixed in position, but the heat source cannot expand thermally due to restricted movement
Solution Approach 1:
The bonding structure is divided into two separate bonding portions: a first bonding portion that bonds the heat transfer member to the support portion, and a second bonding portion that bonds the heat source to the support portion. This segmentation allows the heat source to expand thermally without being constrained by the adhesive bonding the heat transfer member to the support portion.
Solution Approach 2:
The adhesive layer is extracted from the interface between the heat source and heat transfer member, and placed only in the bonding portions. This removes the harmful effect of adhesive restriction on thermal expansion while maintaining the fixing stability through the bonding portions.
2Stability of the object's composition
If the heat source is bonded directly to the support portion, then fixing stability is improved, but the heat transfer member cannot be properly positioned
Solution Approach 1:
The bonding system is segmented into multiple bonding portions, allowing the heat transfer member to be positioned and bonded separately from the heat source bonding. This facilitates easier assembly while maintaining overall fixing stability.
Solution Approach 2:
The heat transfer member acts as an intermediary element between the heat source and support portion, with its own dedicated bonding portion. This intermediary structure simplifies the assembly process by allowing separate bonding operations.
3Stability of the object's composition
If adhesive is applied between the heat transfer member and heat source, then the heat transfer member is secured, but thermal expansion causes misregistration and potential breakage
Solution Approach 1:
The adhesive is extracted from the interface between the heat source and heat transfer member. This eliminates the source of misregistration and breakage problems during thermal expansion, while the bonding portions maintain component stability through alternative bonding arrangements.
Solution Approach 2:
The bonding functions are segmented into separate bonding portions, allowing the heat source to expand thermally without adhesive constraint, while the heat transfer member remains securely positioned through its own bonding portion to the support structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures stable fixation of the heat source to the support portion, preventing misregistration and breakage, while maintaining effective heat transfer and reducing temperature variations across the heat source.
Implementation Method 1
at least one adhesive layer that fixes the heat source and the support portion to each other
Implementation Method 2
a heat transfer member disposed at a portion other than a portion between the adhesive layer and the heat source to conduct heat of a portion of the heat source to another portion of the heat source
Implementation Method 3
a heat source
Data Source
AI summary
A fixing device includes a heat source, a support portion, at least one adhesive layer, and a heat transfer member. The support portion supports the heat source. The at least one adhesive layer fixes the heat source and the support portion to each other. The heat transfer member is disposed at a portion other than a portion between the adhesive layer and the heat source to conduct heat of a portion of the heat source to another portion of the heat source.


