Fixing Jig Suction Pickup for Thin Semiconductor Chips
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing extremely thin semiconductor chips with adhesive applications face challenges such as increased adhesive force due to lamination, leading to difficulties in safe pickup and potential chip damage, as well as issues with maintaining consistent holding force during the pickup process.
Innovation Solution
A method involving a fixing jig with a close-contact layer and protrusions, where the die bonding adhesive layer and wafer are laminated, allowing for complete cutting and subsequent pickup without the need for pushing up with a fine needle, utilizing suction force to deform the close-contact layer and maintain consistent contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an adhesive layer in a film shape is laminated on a wafer for die bonding, then the adhesive application becomes uniform and prevents running off, but the adhesive force between the dicing sheet and adhesive layer increases due to lamination, making chip pickup difficult
Solution Approach 1:
A release sheet is introduced as an intermediary layer between the adhesive layer and the dicing sheet. This release sheet has controlled adhesion properties that allow it to bond with both the adhesive layer during lamination and the dicing sheet during cutting, while enabling easy separation during chip pickup. The release sheet acts as a mediator that prevents excessive bonding between the adhesive layer and dicing sheet, solving the pickup difficulty caused by increased adhesive force.
Solution Approach 2:
The system transitions from a static bonding interface to a dynamic multi-stage bonding process. The release sheet provides different bonding characteristics at different stages: strong bonding during lamination and cutting, then controlled release during pickup. This dynamic behavior allows the same interface to serve multiple functions with varying adhesion requirements throughout the manufacturing process.
2Ease of operation
If a pickup needle pushes up a chip for pickup, then the chip can be lifted from the substrate, but extremely thin chips may be damaged by the pushing up force
Solution Approach 1:
The mechanical pushing-up action of a needle is replaced with a suction-based pickup method. A suction cup is used to apply negative pressure to the chip surface, lifting the chip without mechanical contact or pushing forces. This substitution eliminates the risk of damage to extremely thin chips while maintaining effective pickup capability.
3Device complexity
If the adhesive sheet is used for both dicing and die bonding without a separate dicing sheet, then the lamination process is simplified, but the holding force for chip pickup varies during continuous pickup operations
Solution Approach 1:
The adhesive sheet system is segmented into functionally distinct layers: a die bonding adhesive layer for bonding chips to substrates and a release sheet for facilitating pickup operations. This segmentation allows each layer to be optimized for its specific function, with the release sheet providing consistent release properties that maintain stable holding force during continuous pickup operations, while the adhesive layer provides strong bonding when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and efficient pickup of extremely thin chips without damage, maintaining consistent holding force and preventing chip displacement, even during continuous processing, thereby ensuring reliable transfer to the die bonding step.
Implementation Method 1
a suction table of a porous material is used in place of a pressure sensitive adhesive tape, and a suction of a suction table is stopped to cancel the holding force of a chip in the case in which a chip is picked up
Implementation Method 2
a chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig
Data Source
AI summary
A method for producing a chip (13) in which a die bonding adhesive layer (24) and a wafer (1) are laminated on a close-contact layer (31) of a fixing jig (3), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base (30) that is provided with a plurality of protrusions (36) on one side and a sidewall (35) at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall. The jig base is provided with at least one through hole (38) penetrating the outside and the partitioned space, and the close-contact layer can be deformed by sucking air from the partitioned space via the through hole of the fixing jig.