Flame Retardant Compound for PCB Resin Composition
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Solution Overview
Problem
Conventional flame retardant materials for insulation layers in electronic devices compromise thermal expansion, glass transition temperature, copper foil peeling strength, and dielectric properties, leading to reliability issues in high-density electronic components.
Innovation Solution
A flame retardant compound with a structure represented by Formula (I), comprising a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or diphenylphosphine oxide functional group, is synthesized and incorporated into a resin composition, which includes vinyl-containing polyphenylene ether resin and maleimide resin, to enhance thermal resistance and dielectric properties while maintaining low thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional flame retardant materials are used in insulation layers, then flame retardancy is improved, but thermal expansion ratio increases and glass transition temperature decreases
Solution Approach 1:
The patent employs a composite flame retardant system combining phosphorus-containing compounds (DOPO or DPPO functional groups) with silicon-containing compounds (silane or siloxane structures). This composite approach creates a synergistic effect where the phosphorus provides flame retardancy while the silicon component maintains dimensional stability and thermal properties, resolving the contradiction between flame retardancy and thermal expansion control.
Solution Approach 2:
The patent modifies the chemical structure parameters of the flame retardant by incorporating specific functional groups (DOPO, DPPO) and controlling molecular weight, hydroxyl value, and acid value parameters. By adjusting these chemical parameters, the formulation achieves both effective flame retardancy and controlled thermal expansion characteristics.
2Object-affected harmful factors
If conventional flame retardant materials are used in insulation layers, then flame retardancy is improved, but copper foil peeling strength decreases
Solution Approach 1:
The patent introduces silicon-containing compounds (silane or siloxane structures) as intermediary components that bridge the flame retardant functionality with the resin matrix and copper foil interface. These intermediary structures enhance adhesion between the insulation layer and copper foil while maintaining flame retardancy, preventing the peeling strength degradation that occurs with conventional flame retardants.
3Object-affected harmful factors
If conventional flame retardant materials are used in insulation layers, then flame retardancy is improved, but dielectric properties deteriorate
Solution Approach 1:
The patent applies local quality by concentrating the flame retardant functional groups (phosphorus-containing) in specific regions while maintaining the overall resin matrix with good dielectric properties. The silicon-containing components help localize the flame retardant effect without allowing it to degrade the bulk dielectric characteristics of the insulation material.
4Object-affected harmful factors
If conventional flame retardant materials are used in insulation layers, then flame retardancy is improved, but thermal resistance after moisture absorption decreases
Solution Approach 1:
Instead of allowing moisture to degrade thermal resistance, the patent uses silicon-containing compounds that inherently possess moisture resistance and dimensional stability. This inverted approach leverages the hydrophobic and dimensionally stable nature of silicon-based structures to counteract the detrimental effects of moisture absorption on thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The compound improves copper foil peeling strength, thermal resistance after moisture absorption, dielectric constant, and flame retardancy, achieving a glass transition temperature of at least 200°C and a Z-axis thermal expansion ratio of ≤2.90%, with V-0 or V-1 flame retardancy ratings.
Implementation Method 1
reacting a diphenyldivinylsilane with a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or a diphenylphosphine oxide compound
Data Source
AI summary
A compound has a structure of Formula (I) below, wherein E represents a 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide functional group or a diphenylphosphine oxide functional group. Moreover, a method of making the compound of Formula (I), a resin composition including the compound of Formula (I) and a resin additive and an article made from the resin composition are described. The article includes a prepreg, a resin film, a laminate or a printed circuit board, wherein one or more properties including copper foil peeling strength, Z-axis ratio of thermal expansion, glass transition temperature, flame retardancy, thermal resistance after moisture absorption, dielectric constant, and dissipation factor may be improved.