Flame Retardant Structure for Electronic Components

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Solution Overview

Problem

Conventional flame retardant structures for electronic components are either expensive and heavy when made of metal or prone to melting and inadequate protection when made of plastic, failing to effectively shield components from external heat sources.

Innovation Solution

A flame retardant structure comprising a metal heat dissipation module and a plastic part that forms a receiving space around an electronic component, where the plastic part melts upon heating to fill and cover the component, providing protection by sealing the space and cutting off airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal shell is used as flame retardant structure, then fire protection capability is improved, but weight and cost increase

Engineering Contradiction:

Improvefire protection capabilityVSAvoidweight

Core Design Contradiction:

ReliabilityVSWeight of moving object

Solution Approach 1:

The patent uses a composite structure combining metal heat dissipation module with plastic parts (first plastic part and second plastic part). The metal module provides heat conduction and structural support, while the plastic parts provide flame retardant protection and sealing. This composite approach achieves fire protection capability comparable to metal shells but with reduced weight and cost.

Inventive Principle:

Principle #40Composite materials

2Weight of moving object

If plastic is used as flame retardant structure, then cost and weight are reduced, but protection capability deteriorates when plastic melts

Engineering Contradiction:

ImproveweightVSAvoidprotection capability

Core Design Contradiction:

Weight of moving objectVSReliability

Solution Approach 1:

The patent intentionally utilizes the melting phase transition of the plastic part as a protective mechanism. When the electronic component overheats, the plastic part melts and flows to fill the receiving space, completely covering and sealing the electronic component. This phase transition creates an airtight seal that isolates the component from external air and heat, providing effective fire protection exactly when needed.

Inventive Principle:

Principle #36Phase transitions

Solution Approach 2:

The patent converts the harmful effect of plastic melting (which would normally be seen as structural failure) into a beneficial protective action. The melting plastic flows to seal the receiving space and cover the electronic component, transforming the weakness of plastic at high temperatures into an active fire suppression mechanism that isolates the component from oxygen and external heat sources.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If plastic flame retardant structure is used without guiding part, then manufacturing is simplified, but plastic flow control deteriorates

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidplastic flow control

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent divides the plastic structure into separate functional parts: the first plastic part (lid) and the second plastic part (base with receiving space). This segmentation allows each part to be manufactured independently with simple structures, while their assembly creates the complete fire protection system. The guiding part in the second plastic part ensures proper positioning during assembly without complicating the overall manufacturing process.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution offers flexible, cost-effective, and reliable protection for electronic components by ensuring complete coverage and isolation from heat, enhancing their fire retardant properties.

Implementation Method 1

the plastic part melts upon heating to fill and cover the component

Methodology Applied

Scientific EffectMelting: Melting

Implementation Method 2

metal heat dissipation module

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10314205B2Flame retardant structure for electronic component

Publication Date: 2019.06.04 NANNING FUGUI PRECISION IND CO LTD

AI summary

A flame retardant structure for electronic component includes a printed circuit board, an electronic component, a metal heat dissipation module, a first plastic part and a receiving space formed by the printed circuit board and the metal heat dissipation module. The metal heat dissipation module has an opening, or the metal heat dissipation module and the printed circuit board form an opening. The electronic component is located in the receiving space. When the electronic component is heated, the first plastic part melts and enters into the receiving space through the opening, and the first plastic part melts to cover and protect the electronic component. The first plastic part is offered with different structures to match with different metal heat dissipation module for flexible use, low cost and high fire retardant effect.