Flanged Collet for Automated Die Detachment from Adhesive Surfaces
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Solution Overview
Problem
Existing pick-and-place tools face challenges in efficiently detaching small electronic devices from adhesive surfaces like Gel-Pak, where the initial adhesion force exceeds the vacuum suction force, requiring manual and time-consuming methods for removal.
Innovation Solution
A collet with a flat platform and a flange that pushes against the side of the die perpendicular to its planar surface, allowing for a shearing motion to reduce adhesion force before vacuum suction picks up the die, enabling automated detachment without manual tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If vacuum suction force is increased to pick up small dice, then the pick-up capability is improved, but the adhesive surface design becomes more constrained and complex
Solution Approach 1:
The pick-up process is segmented into two distinct phases: first, vacuum suction is applied to partially detach the die from the gel membrane; second, a flange component provides additional pushing force to complete the detachment. This segmentation allows each component to perform its function optimally without requiring excessive complexity in the adhesive surface design.
Solution Approach 2:
The invention transitions from a single-dimensional vacuum suction approach to a two-dimensional force application system. The flange component adds a horizontal pushing dimension to complement the vertical vacuum suction force, enabling effective pick-up of small dice without modifying the adhesive surface complexity.
2Force
If manual peeling method is used to remove dice, then the adhesion force can be overcome, but the productivity decreases and time consumption increases
Solution Approach 1:
The collet device performs the detachment function automatically without requiring manual intervention. The flange component self-adjusts to push the die while the vacuum system simultaneously holds the die, creating an automated self-service pick-up process that maintains high productivity.
Solution Approach 2:
The manual mechanical peeling action is replaced by an automated mechanical system consisting of the flange pushing mechanism and vacuum suction system. This substitution eliminates manual labor while maintaining the effectiveness of overcoming adhesion forces, thereby preserving productivity.
3Length of moving object
If die dimensions are reduced to 300 μm by 400 μm, then the device size is improved, but the vacuum suction area decreases reducing pick-up effectiveness
Solution Approach 1:
Instead of relying on large-area vacuum suction, the invention concentrates the pick-up force on the local edge region of the die where the flange makes contact. This local quality approach allows effective pick-up of small dice by focusing force application on the most critical detachment point rather than distributing force across the entire die surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described method effectively automates the detachment of small electronic devices from adhesive surfaces, reducing manual handling and time, while minimizing the risk of damage, by using a combination of shearing and vacuum suction.
Implementation Method 1
vacuum is applied on the non-adhesive side of the gel membrane such that the gel membrane is deformed and conforms to the shape of the mesh. The die is partially detached from the gel membrane as a result of vacuum force on the membrane.
Implementation Method 2
a flange protruding from one side of the platform that is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process
Data Source
AI summary
A collet is provided for picking up a die mounted on an adhesive surface. A flat platform at an end of the collet is configured to hold a planar surface of the die during pick-up of the die and a flange protruding from one side of the platform is operative to push against a side of the die which is substantially perpendicular to the planar surface of the die during a die pick-up process.