Flared Tip Package Lead Bump Contact for Miniaturized IC Packaging
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Solution Overview
Problem
As integrated circuit packages shrink in size, there is a growing need for increased electrical connections while maintaining precision and reliability, but existing solutions have not effectively addressed this challenge, leading to difficulties in connecting these smaller packages to circuit boards for enhanced functionality, speed, and performance.
Innovation Solution
The solution involves a base panel with a cavity and a flared tip package lead, a bump contact, and encapsulation, where a resist mask is applied with an opening offset from the cavity, allowing for precise electrical connections and improved thermal dissipation, with the package lead having a flared tip intersecting the encapsulation, and a bump contact exposed from the base side, enhancing connectivity and cooling capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If package size is reduced to meet miniaturization demands, then product size decreases, but the number of electrical connections must increase which complicates the packaging structure
Solution Approach 1:
The patent transitions from planar lead arrangements to three-dimensional立体 connections by forming bump contacts that protrude from the package surface. This allows electrical connections to extend in the vertical dimension rather than only horizontally, enabling more connections within a smaller footprint without proportionally increasing structural complexity
Solution Approach 2:
The packaging structure is segmented into distinct functional zones: the cavity region for device mounting, the bump contact regions for electrical connections, and the lead frame portions for external connectivity. This segmentation allows each region to be optimized independently, managing complexity through functional decomposition
2Adaptability or versatility
If more electrical connections are added to smaller packages, then functionality increases, but manufacturing precision requirements increase
Solution Approach 1:
The lead frame is pre-formed with precisely positioned openings and bump contact structures before device assembly. The resist mask is applied with pre-defined patterns that guide subsequent plating and bump formation. These preliminary actions establish precise connection locations in advance, ensuring manufacturing precision is maintained even as the number of connections increases
Solution Approach 2:
The bump contacts serve as intermediary elements between the internal circuitry and external leads. These standardized intermediate structures provide consistent, precisely-controlled connection points that simplify the overall manufacturing process and maintain precision across multiple connection points
3Ease of manufacture
If traditional lead connections are used, then manufacturing is simpler, but thermal dissipation and convection cooling are insufficient
Solution Approach 1:
The bump contacts and lead frame structures serve multiple functions simultaneously: they provide electrical connectivity and also act as thermal conduction paths and convection cooling surfaces. This multi-functionality allows the same structural elements to address electrical, thermal, and mechanical requirements without adding separate components, maintaining manufacturing simplicity while improving thermal performance
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base panel having a first side with a cavity and a second side opposite the first side; connecting an integrated circuit device and the first side; applying a resist mask having an opening on the second side, the opening offset from the cavity; forming a bump contact in the opening; applying an encapsulation in the cavity over the integrated circuit device and the first side; and forming a package lead by removing a portion of the base panel under the cavity, a flared tip of the package lead intersecting a base side of the encapsulation.