Flash LED Cover Cooling Sheet With Heat Diffusion and Reflection
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Solution Overview
Problem
Portable electronic devices with flash LEDs experience localized heating due to radiant energy, leading to temperature increases that can cause user inconvenience and potential accidents, with existing heat dissipation designs focusing primarily on processors and camera modules rather than flash LEDs.
Innovation Solution
Incorporating a heat dissipation structure in electronic devices that includes a heat dissipation sheet with a heat diffusion member and a light reflection member to manage heat generated by flash LEDs, which can be attached to the cover surrounding the light transmission portion or include a heat insulation member and light reflection member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a flash LED is used to emit light, then illumination intensity is improved, but temperature increases causing harmful thermal effects
Solution Approach 1:
The patent extracts the harmful radiant energy and heat away from the light transmission path by introducing a light reflection member that redirects light and heat toward the inner space of the electronic device, separating the useful illumination function from the harmful thermal effects
Solution Approach 2:
The light reflection member acts as an intermediary between the flash LED and the cover, intercepting radiant energy and heat before they can cause localized heating of the cover, while still allowing the light emission function to be fulfilled
2Temperature
If heat dissipation structure is added to manage flash LED heat, then temperature control is improved, but device complexity increases
Solution Approach 1:
The light reflection member is designed to perform multiple functions simultaneously: it reflects light to maintain illumination intensity, redirects heat toward the inner space for dissipation, and reduces the need for separate heat dissipation components, thereby managing temperature without significantly increasing device complexity
Solution Approach 2:
The patent merges the light reflection function with the heat management function into a single integrated structure, combining optical control and thermal management capabilities in one component rather than requiring separate systems for each function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from flash LEDs, reducing the temperature of the device cover and preventing overheating, thereby enhancing user safety and device performance.
Implementation Method 1
a light reflection member configured to reflect radiant energy from the light source in a direction toward the inner space
Implementation Method 2
a heat diffusion member configured to dissipate heat from the light source
Implementation Method 3
a heat diffusion member configured to dissipate heat from the light source
Data Source
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AI summary
An electronic device is provided. The electronic device may comprise: a cover including a first surface, which is a part of the outer surface of the electronic device, and a second surface, which faces the opposite direction of the first surface and includes a light transmission portion; a substrate arranged in the inner space of the electronic device; a light source, which is arranged on the substrate and irradiates light toward the light transmission portion; and a heat dissipation sheet which is attached to the second surface of the cover so as to encompass at least a portion of the light transmission portion on the second surface of the cover, and which includes a heat diffusion member and a light reflection member.