Flash-Free Over-Molding LED Array Substrates

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Solution Overview

Problem

The existing molding processes for LED array substrates, particularly compression molding, are inefficient due to the need for manual cleaning of seams and flash, which is time-consuming and challenging with flexible substrates having perforations or grooves.

Innovation Solution

A system utilizing a protective tape applied to the substrate before molding, which protects electrical contact regions and collects molding flash for easy removal after the process, reducing manual labor and ensuring a clean, flash-free substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If compression molding is used to create encapsulations, then the molding process is applicable to both thermoplastics and thermosets, but manual cleaning of seams and flash becomes tedious, time-consuming, and inefficient

Engineering Contradiction:

Improvematerial compatibilityVSAvoidcleaning time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

A release agent is applied to the molding surface before the molding process. This preliminary action prevents flash and seam formation during molding, eliminating the need for subsequent manual cleaning operations. The release agent creates a barrier that allows clean separation of the molded encapsulation from the molding surface.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

A release agent serves as an intermediary substance between the molding surface and the molding material. This intermediary layer prevents direct adhesion that causes flash and seams, enabling easy removal of the molded product without cleaning operations.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If compression molding is used, then encapsulations can be molded, but the process is batch oriented and requires manual cleaning operations

Engineering Contradiction:

Improvemolding capabilityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Ease of manufactureVSProductivity

Solution Approach 1:

The release agent is applied in advance to the molding surface, preparing it for the molding operation. This preliminary preparation enables continuous molding operations without interruption for cleaning, thereby improving productivity while maintaining ease of manufacture.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The release agent enables the molding process to be self-cleaning. The molded encapsulations separate cleanly from the molding surface without requiring external cleaning operations, allowing the system to maintain itself across multiple batch cycles.

Inventive Principle:

Principle #25Self-service

3Manufacturing precision

If manual cleaning of flash is performed, then seams and flash are removed, but the operation is especially tedious and time-consuming for flexible substrates with perforations, grooves, or gaps

Engineering Contradiction:

Improvesurface cleanlinessVSAvoidcleaning difficulty

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The release agent is applied before molding to prevent flash and seam formation in the first place. This preliminary action eliminates the need for subsequent cleaning operations, especially on complex flexible substrates with perforations, grooves, or gaps where cleaning would be particularly difficult.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The release agent, which might seem like an additional material step, actually converts the potential harm of flash and seam formation into a benefit by preventing these defects from occurring in the first place, thereby simplifying the overall manufacturing process.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables a semi-automated, efficient over-molding process that simplifies the removal of molding material flash, resulting in a clean substrate with reduced manual operations and improved processing speed.

Implementation Method 1

a portion of protective tape having an adhesive surface attached to a substrate surface

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

pressing a molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS9950468B2System for flash-free over-molding of LED array substrates

Publication Date: 2018.04.24 BRIDGELUX INC

AI summary

A system for flash-free over-molding of LED array substrates. In an aspect, a method is provided for molding encapsulations onto an LED array substrate. The method includes attaching a protective tape onto a substrate surface of the substrate so that openings in the protective tape align with LED devices of the substrate and applying molding material onto a molding surface of a molding tool and to portions of the substrate exposed through the openings in the protective tape. The method also includes pressing the molding surface and the substrate surface together at a selected pressure and a selected temperature so that encapsulations are formed on the portions of the substrate exposed through the openings in the protective tape, separating the molding surface from the substrate surface, and removing the protective tape so that molding material flash is removed from the substrate leaving a clean molded substrate.