Flash Memory I/O Command Batching for Thermal Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flash memory devices experience temperature rise and malfunction due to intensive executions of input-output commands, leading to unexpected errors and malfunctions.
Innovation Solution
A method and apparatus that control I/O commands by obtaining device temperature, fetching commands in batches, and adjusting execution and pause times based on temperature thresholds to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If I/O commands are executed intensively to improve productivity, then data processing speed is improved, but device temperature rises causing malfunctions
Solution Approach 1:
The patent implements periodic action by introducing pause time periods between batches of I/O command executions. The controller executes commands in batches during fetching time periods, then pauses for a calculated pause time period before executing the next batch. This periodic execution pattern allows the device to cool down between operations, preventing temperature rise while maintaining productive data processing.
Solution Approach 2:
The patent applies dynamics by making the pause time period variable rather than fixed. The controller dynamically calculates the pause time period based on the actual execution time period of the I/O commands. When commands execute faster, the pause time is adjusted accordingly, allowing the system to adapt to varying workloads and maintain optimal temperature management while maximizing productivity.
2Productivity
If I/O commands are executed continuously to improve productivity, then data processing throughput is improved, but device reliability decreases due to overheating
Solution Approach 1:
The patent implements feedback by having the controller monitor the actual execution time period of I/O commands and use this information to calculate the pause time period. This feedback mechanism ensures that the pause time is dynamically adjusted based on real-time performance data, allowing the system to maintain reliable operation by preventing overheating while maximizing data processing throughput during acceptable temperature ranges.
3Temperature
If pause time period is increased to reduce temperature, then device temperature is controlled, but data processing time increases
Solution Approach 1:
The patent applies parameter changes by dynamically adjusting the pause time period parameter based on the actual execution time period of I/O commands. Rather than using a fixed long pause time that would unnecessarily delay processing, the system changes the pause parameter to match actual workload characteristics, maintaining temperature control while minimizing time loss during data processing operations.
Data Source
AI summary
The invention introduces a method for controlling executions of input-output (I/O) commands, performed by a processing unit, which includes: obtaining a current temperature of a device side; fetching I/O commands from a command queue during a fetching time period, and executing the I/O commands to read user data from the flash module, and/or program user data into the flash module in response to the current temperature of the device side exceeding a threshold; calculating a length of an actual execution time period for the I/O commands, and calculating a length of a pause time period according to the length of the actual execution time period after the I/O commands are executed completely; and not fetching and executing any I/O command in the command queue during the pause time period.