Flash Lamp Susceptor Slit Design for Thermal Stress

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Solution Overview

Problem

Heat treatment susceptors for semiconductor wafers using flash lamps face challenges in preventing deformation and breakage due to rapid thermal expansion, leading to substrate warping and potential breakage during flash irradiation.

Innovation Solution

A heat treatment susceptor design featuring a holding plate with slits around substrate support pins, allowing for deflection and absorption of increased load during substrate deformation, thereby reducing stress and preventing breakage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If flash lamp irradiation is used for rapid thermal annealing, then annealing speed and precision are improved, but substrate deformation and breakage occur due to rapid thermal expansion

Engineering Contradiction:
Improveannealing speedVSAvoidsubstrate integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a cushioning structure consisting of elastic members (springs or rubber) between the susceptor and the substrate support pins. This cushioning structure is designed in advance to absorb the impact forces generated during flash lamp irradiation, preventing substrate breakage while maintaining the rapid annealing process

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Manufacturing precision

If rigid support structure is used to hold substrate, then positioning precision is improved, but stress concentration occurs during thermal expansion leading to breakage

Engineering Contradiction:
Improvesubstrate positioning precisionVSAvoidresistance to thermal stress
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The patent changes the mechanical parameters of the support structure by introducing elastic members that can dynamically adjust their stiffness. The elastic members have a designed elasticity that allows them to be rigid enough for precise positioning but flexible enough to absorb thermal expansion stresses, resolving the contradiction between positioning precision and stress resistance

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If simple susceptor structure is used, then device complexity is reduced, but ability to absorb deformation stress is insufficient

Engineering Contradiction:
Improvesusceptor structure complexityVSAvoidstress absorption capability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent segments the susceptor structure into distinct functional components: the holding plate, multiple substrate support pins, and elastic members. This segmentation allows each component to be optimized independently - the holding plate provides structural support, the pins provide positioning, and the elastic members provide stress absorption, achieving reliable stress absorption without excessive overall complexity

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The susceptor effectively absorbs deformation-induced stress, preventing substrate breakage and maintaining stability during flash irradiation with a simple configuration.

Implementation Method 1

The flash lamp instantaneously emits a flash of light having extremely large energy to a front surface of the semiconductor wafer, thus a temperature of the front surface of the semiconductor wafer rapidly increases, however, a temperature of a back surface of the semiconductor wafer does not increase so much. Thus, rapid thermal expansion occurs only in the front surface of the semiconductor wafer

Methodology Applied
Scientific EffectRapid thermal expansion: Thermal Expansion

Implementation Method 2

at least one slit is formed around a position where at least one of the substrate support bodies is mounted upright in the holding plate, and the slit includes at least one bending portion or one corner portion... a portion surrounded by the slit is deflected, thus the load on the substrate support body is absorbed

Methodology Applied
Scientific EffectStress absorption through deflection: Elasticity

Data Source

PatentUS20230091404A1Heat treatment susceptor and heat treatment apparatus
Publication Date: 2023.03.23 SCREEN HOLDINGS CO LTD
  • US20230091404A1 patent drawing
  • US20230091404A1 patent drawing
  • US20230091404A1 patent drawing

AI summary

A heat treatment susceptor holds a substrate when the substrate is irradiated with a flash of light from flash lamps to perform a heat treatment on the substrate. The heat treatment susceptor includes: a holding plate having a planar holding surface; and a plurality of substrate support bodies mounted upright on the holding surface, wherein a slit is formed around a position where at least one of the substrate support bodies is mounted upright in the holding plate, and the slit includes at least one bending portion or a corner portion.