Flash Memory Die Interconnection via Identical Pads and Cuttable Wires
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Solution Overview
Problem
The existing manufacturing processes for flash memory dies are complex, costly, and difficult to customize due to the need for different wafer layouts and masks for each die configuration, making interconnection challenging and expensive.
Innovation Solution
The implementation of a controller unit that connects identical dies with power supply, grounding, input/output, selection, and standby/busy pads on both faces, allowing for parallel connections to the controller unit and optional wire connections that can be cut or patched, enabling flexible and customized interconnection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different wafer layouts and masks are designed for each die configuration, then customization is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies universality by designing identical wafer layouts and masks that can be used for multiple die configurations. The same master mask set is reused to create different die arrangements, eliminating the need for custom masks for each configuration. This allows a single universal layout to serve multiple customization needs through different stacking and bonding arrangements.
Solution Approach 2:
The patent segments the customization process from the manufacturing process. Instead of customizing at the mask level, customization is achieved at the assembly level through different die stacking sequences and bonding configurations. This separates the standardized manufacturing step from the flexible assembly step, reducing manufacturing complexity while maintaining adaptability.
2Adaptability or versatility
If different wafer layouts and masks are designed for each die configuration, then customization is achieved, but manufacturing cost increases
Solution Approach 1:
The patent applies universality by designing identical wafer layouts and masks that can be used for multiple die configurations. The same master mask set is reused to create different die arrangements, eliminating the need for custom masks for each configuration. This allows a single universal layout to serve multiple customization needs through different stacking and bonding arrangements.
Solution Approach 2:
The patent uses copying by creating multiple identical copies of the same die layout from a single master mask. Instead of creating unique masks for each configuration, the same mask pattern is copied and reused across different die stacks, with customization achieved through arrangement rather than design variation.
3Adaptability or versatility
If dies require different layouts, then specific interconnection requirements are met, but ease of manufacture deteriorates
Solution Approach 1:
The patent moves the degree of freedom for interconnection from the two-dimensional wafer layout plane to the three-dimensional stacking dimension. Instead of achieving interconnection flexibility through different planar layouts, the patent uses vertical stacking of identical dies with selective bonding, allowing various interconnection patterns through different stacking sequences without changing the base die layout.
Solution Approach 2:
The patent segments the interconnection flexibility from the die design to the assembly process. Each die is designed with standardized pads and identical layouts, while the interconnection flexibility is achieved through selective bonding and stacking arrangements during assembly, separating the standardized manufacturing step from the flexible configuration step.
Data Source
AI summary
A flash memory includes a controller unit and dies. The dies are connected to a controller unit. Each of the dies includes an upper face and a lower face. Each of the dies includes at least one power supply pad, at least one grounding pad, at least one input/output pad, selection pads and standby/busy pads on each of the upper and lower faces. The power supply pad is connected to the controller unit. The grounding pad is connected to the power supply pad in parallel. The input/output pad is connected to the grounding pad in parallel. The selection pads are connected to the controller unit and connected to one another with a wire that can be cut if so desired. The standby/busy pads are connected to the controller unit and connected to one another with a wire that can be cut if so desired.