Flash Module Latch Assembly and Super Capacitor Design

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Solution Overview

Problem

Current storage assembly systems face challenges in securely and efficiently managing airflow and power within flash modules, particularly in ensuring data integrity during disconnection and maintaining thermal management, while also being tamper-resistant and hot-swappable.

Innovation Solution

The implementation of a flash module design featuring a latch assembly for secure engagement, a thermal interface material for heat dissipation, a super capacitor for power persistence, and a hot-swap controller for data transfer, along with a latch assembly that allows controllable disengagement and press-fit covers for tamper resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If a latch assembly is added for secure engagement and hot-swapping, then ease of operation is improved, but device complexity increases

Engineering Contradiction:

Improvehot-swappable capabilityVSAvoidlatch assembly structure

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The flash module is divided into separable components including the latch assembly, PCB, and cover, allowing independent manipulation of each part. The latch assembly itself is segmented into a latch member and a reversing link, enabling controlled engagement and disengagement without affecting other components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The latch assembly incorporates a movable latch member that can transition between engaged and disengaged states. The reversing link provides dynamic movement to translate pull force into latch member motion, enabling hot-swappable operation while maintaining structural integrity.

Inventive Principle:

Principle #15Dynamics

2Temperature

If thermal interface material is applied for heat dissipation, then temperature control is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal dissipationVSAvoidTIM application accuracy

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

Thermal interface material serves as an intermediary substance between the PCB and cover, filling microscopic gaps and imperfections in the mating surfaces. This mediator enables effective thermal transfer even when manufacturing precision is limited, as the TIM compensates for surface irregularities.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If a super capacitor is added for power persistence during disconnection, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improvedata integrity during disconnectionVSAvoidpower management components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The super capacitor is pre-charged during normal operation to store electrical energy. When power disconnection occurs, this previously stored energy is immediately available to maintain power to the flash memory, ensuring data integrity without requiring complex real-time power management.

Inventive Principle:

Principle #10Preliminary action

4Reliability

If press-fit covers are used for tamper resistance, then security is improved, but ease of repair decreases

Engineering Contradiction:

Improvetamper resistanceVSAvoidcomponent accessibility

Core Design Contradiction:

ReliabilityVSEase of repair

Solution Approach 1:

The cover employs press-fit features at specific locations to provide tamper resistance where needed, while maintaining standard engagement methods in other areas. This localized application of security features protects critical components without making the entire device difficult to service.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances airflow management, ensures data integrity during power disconnection, maintains effective thermal dissipation, and provides a tamper-resistant, hot-swappable solution for flash modules within storage assembly systems.

Implementation Method 1

The top and bottom covers may be in direct contact with a thermal interface material that may be in direct contact with all (or substantially all or a significant portion of) the components on the top and bottom surfaces of the PCB

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The flash module may include a super capacitor that may be configured to maintain power for a period of time when the flash module is disconnected

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentEP3150034B1Flash module

Publication Date: 2020.01.15 DELL EMC

Figure 1A
Figure 1B
Figure 1C

AI summary

A flash module includes a top cover (200) and a bottom cover (210), a printed circuit board (PCB) (204) comprising memory (238), solid state storage (236), a storage controller configured to manage the memory and the solid state storage, and at least one integrated connector, and a capacitor (206), in which the capacitor is configured to power at least the storage controller when the flash module is disconnected from an external power source.