Flashlamp Low-Inductance Cable for Thin Film Curing
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Solution Overview
Problem
Thermal processing of thin films on low-temperature substrates is limited, as inexpensive substrates have lower maximum working temperatures, leading to increased processing time or the need for more expensive high-temperature substrates, both of which are economically undesirable.
Innovation Solution
A curing apparatus with a low-inductance cable and a flashlamp system using pulse-width modulation (PWM) to provide customized thermal profiles for thin films on moving substrates, allowing for efficient curing on low-temperature substrates by synchronizing flashlamp pulses with substrate conveyance speed and using a computer control system for real-time adjustment of pulse characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If the entire substrate stack is heated to the maximum working temperature of the substrate, then processing time is minimized, but substrate cost increases due to the need for high-temperature substrates
Solution Approach 1:
The patent applies local quality by directing intense pulsed light only to the thin film region requiring curing, rather than heating the entire substrate stack. This localized energy delivery enables rapid curing of the film without subjecting the low-temperature substrate to excessive heat, thus reducing processing time while maintaining compatibility with inexpensive substrates
Solution Approach 2:
The patent employs periodic action through pulsed light delivery, where high-intensity light pulses are applied in controlled intervals to achieve rapid curing. This pulsed approach allows the thin film to receive sufficient thermal energy for curing while the substrate remains below its maximum working temperature, eliminating the need for expensive high-temperature substrates
2Ease of manufacture
If increased processing time is used to cure thin films on low-temperature substrates, then substrate cost is reduced, but throughput decreases
Solution Approach 1:
The patent uses periodic action through high-intensity pulsed light delivery, where energy is concentrated into short-duration pulses rather than applied continuously at low intensity. This approach achieves rapid curing of thin films on low-temperature substrates, maintaining substrate cost-effectiveness while dramatically increasing throughput compared to conventional slow heating methods
Solution Approach 2:
The patent applies preliminary action by pre-heating or pre-conditioning the thin film or substrate surface before the main curing pulse, or by using a sequence of progressively intensifying pulses. This preparation enables the final curing step to complete rapidly, increasing throughput without requiring expensive high-temperature substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient curing of thin films on low-temperature substrates with optimized thermal profiles, increasing throughput and yield while maintaining cost-effectiveness by precisely controlling thermal gradients and adapting to changes in real-time, resulting in consistent and high-quality film curing.
Implementation Method 1
The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive
Implementation Method 2
The low-inductance cable includes at least one liquid cooling line
Implementation Method 3
The low-inductance cable includes at least one liquid cooling line
Data Source
Figure 1~2
Figure 3a~3d
AI summary
An apparatus for curing thin films is disclosed. The apparatus includes a computer control system, a conveyance system, a flashlamp controller, and a flashlamp. The curing apparatus also includes a high average power, low-inductance cable connected between the flashlamp controller and the flashlamp. The low-inductance cable is smaller in diameter and is more flexible than the prior art and includes at least one liquid cooling line and multiple forward and return path wires interleaved in a regular hexagonal closed packed configuration such that every wire is adjacent to at least one cooling line and at least one wire of opposite polarity.