Flat Cable Bonding via Anisotropic Conductive Film

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The use of connectors for connecting circuit boards and flat cables increases costs while compromising connection stability.

Innovation Solution

An electronic apparatus that utilizes an anisotropic conductive film to bond one end of the flat cable to the circuit board's surface, with an engaging member to restrain the engaged portion of the flat cable, eliminating the need for connectors and maintaining stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a connector is used to connect the flat cable to the circuit board, then connection stability is improved, but costs increase

Engineering Contradiction:
Improveconnection stabilityVSAvoidcosts
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the connector component from the connection system and replaces it with a direct bonding structure using anisotropic conductive film. The flat cable is bonded directly to the circuit board through the ACF without requiring a separate connector, thereby eliminating the cost of the connector while maintaining connection stability through the adhesive and conductive properties of the ACF.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The anisotropic conductive film serves as an intermediary material between the flat cable and the circuit board. This ACF layer provides both mechanical bonding (adhesive function) and electrical connection (conductive function), replacing the need for a traditional connector while ensuring stable connection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a connector is used to connect the flat cable to the circuit board, then connection stability is improved, but device complexity increases

Engineering Contradiction:
Improveconnection stabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connector component is extracted and removed from the system. The connection is achieved through a simpler structure where the flat cable is directly bonded to the circuit board using anisotropic conductive film, reducing the number of parts and simplifying the overall device structure while maintaining connection stability.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The bonding function and electrical connection function are merged into a single anisotropic conductive film layer. This eliminates the need for separate connector components that would otherwise be required to achieve both mechanical attachment and electrical connectivity, thereby reducing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If the flat cable is bonded directly to the circuit board through anisotropic conductive film, then costs are reduced, but movement restraint may be insufficient

Engineering Contradiction:
ImprovecostsVSAvoidmovement restraint
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent introduces a reinforcing plate that extends in a direction different from the thickness direction of the flat cable. This reinforcing plate provides additional dimensional support and restraint, preventing movement of the flat cable in directions other than the thickness direction, thereby compensating for the reduced movement restraint in the thickness direction caused by eliminating the connector.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces costs while maintaining connection stability between the flat cable and circuit board, preventing unintended movement and ensuring reliable connectivity.

Implementation Method 1

one end of which is bonded to the surface of the circuit board through an anisotropic conductive film

Methodology Applied
Scientific EffectAnisotropic conduction: Conduction (electrical)

Implementation Method 2

bonded to the surface of the circuit board through an anisotropic conductive film

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9007774B2Electronic apparatus
Publication Date: 2015.04.14 SONY INTERACTIVE ENTERTAINMENT LLC
  • US9007774B2 patent drawing
  • US9007774B2 patent drawing
  • US9007774B2 patent drawing

AI summary

An electronic apparatus 1 includes a flat cable 70, an end 70a of which is bonded to the front surface of a sub-board 30 through an anisotropic conductive film 79, engaged portions 74A and 74B formed in the flat cable 70, and an intermediate frame 40 that engages with the engaged portions 74A and 74B to restrain the movement of the engaged portions 74A and 74B in a direction away from the electrode on the sub-board 30. Consequently, it is possible to realize a reduction in costs while maintaining connection stability between a flat cable and a circuit board.