Flat Cable Substrate Connection for Terminal-Free PCB Assembly

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Solution Overview

Problem

Existing semiconductor device manufacturing processes face challenges in increasing component mounting area and throughput due to the use of terminals and the complexity of connecting substrates without terminals, leading to reduced manufacturing efficiency and increased costs.

Innovation Solution

A semiconductor device and manufacturing method utilizing flat cables with a formed flat surface, allowing for automatic handling and connection of substrates without terminals, enabling increased component mounting area and manufacturing throughput by using flat cables to connect printed circuit boards, which eliminates the need for terminal mounting and simplifies the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If terminals are used to connect substrates, then connection reliability is improved, but component mounting area is reduced

Engineering Contradiction:

Improveconnection reliabilityVSAvoidcomponent mounting area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The invention extracts and eliminates the terminal components from the substrate connection system. Instead of using separate terminal elements that occupy mounting area, the patent uses bent wiring patterns that are integrated directly into the substrate structure, thereby removing the need for dedicated terminal mounting spaces while maintaining connection functionality.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The invention merges the connection function with the substrate structure itself. The bent wiring patterns are formed as integral parts of the substrate, combining the electrical connection pathway with the substrate body, eliminating the need for separate terminal components and their associated mounting areas.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If a joint member with parallel leads is used to connect substrates, then connection functionality is improved, but manufacturing cost increases due to dedicated machine tools

Engineering Contradiction:

Improveconnection functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention enables the substrate to perform its own connection function through integrated bent wiring patterns. The substrate structure itself provides the connection pathways, eliminating the need for separate joint members with parallel leads and the dedicated manufacturing equipment required to assemble them.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The invention extracts the connection functionality from separate joint member components and integrates it directly into the substrate structure. This eliminates the need for dedicated machine tools required for assembling complex joint members with multiple parallel leads.

Inventive Principle:

Principle #2Taking out (Extraction)

3Area of stationary object

If flat cable is used to connect substrates, then component mounting area is increased, but throughput is reduced due to inability to use automatic holding devices

Engineering Contradiction:

Improvecomponent mounting areaVSAvoidthroughput

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

Instead of making the substrate adaptable to irregular flat cable surfaces, the invention inverts the approach by making the connection element (bent wiring pattern) perfectly flat and planar. This flat surface can be automatically gripped by suction holding devices, enabling automated handling while maintaining the benefits of terminal-free connection.

Inventive Principle:

Principle #13The other way round (Inversion)

Solution Approach 2:

The invention applies a flat surface characteristic to the specific connection region of the bent wiring pattern, while the rest of the substrate can have varied topographies for component mounting. This localized flatness enables automatic handling without compromising the irregular surfaces needed for component attachment elsewhere on the substrate.

Inventive Principle:

Principle #3Local quality

4Reliability

If laser cutting is performed on ceramic substrates while avoiding wiring patterns, then substrate integrity is maintained, but cutting time increases significantly

Engineering Contradiction:

Improvesubstrate integrityVSAvoidcutting time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The invention performs preliminary routing of wiring patterns along the substrate edges and connection paths. This preliminary layout allows subsequent cutting operations to follow predetermined safe paths that avoid wiring patterns, enabling faster cutting without compromising substrate integrity or electrical connections.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS9125308B2Semiconductor device and method of manufacturing thereof

Publication Date: 2015.09.01 MITSUBISHI ELECTRIC CORP

AI summary

A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.