Flat Circuit Board Heatsink for LED Thermal Management
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Solution Overview
Problem
Conventional LED lamp designs face challenges in achieving omnidirectional light distribution, efficient heat removal, reliable electrical connections, and cost-effectiveness, often relying on large die-cast aluminum heat sinks, connectors, and hand soldering, which can lead to reliability issues and increased costs.
Innovation Solution
The design incorporates a flat circuit board that acts as both a heatsink and a substrate for the LEDs, eliminating the need for a separate heatsink and reducing assembly complexity, while using a buck converter and intelligent driver circuit to manage power and light output efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large die-cast aluminum heat sinks are used to remove heat from LEDs, then heat dissipation is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines the heatsink function with the circuit board substrate by using a metal core PCB (MCPCB) with high thermal conductivity materials. The circuit board itself serves as the heatsink, eliminating the need for separate die-cast aluminum heat sinks and reducing overall device complexity while maintaining effective heat dissipation from the LEDs.
Solution Approach 2:
The circuit board performs multiple functions simultaneously: it provides electrical connections for the LEDs, serves as a structural substrate, and acts as a heatsink for thermal management. This multi-functionality reduces the number of separate components needed and simplifies the overall device structure.
2Reliability
If separate heatsinks and connectors are used with hand soldering, then heat removal and electrical connections are achieved, but manufacturing cost and assembly complexity increase
Solution Approach 1:
The patent integrates the electrical connection function and thermal management function into the circuit board structure itself. The metal core PCB provides both electrical pathways and thermal conduction paths, eliminating the need for separate connectors and heatsinks, thereby reducing assembly steps and manufacturing costs while maintaining reliable electrical connections.
Solution Approach 2:
The patent replaces traditional mechanical assembly methods (hand soldering, mechanical fastening of separate heatsinks) with an integrated circuit board design where electrical and thermal connections are established through controlled copper traces and thermal vias during PCB fabrication, enabling automated manufacturing and reducing labor costs.
3Illumination intensity
If multiple LEDs are arranged to produce omnidirectional light, then light output is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The circuit board is designed with LED mounting positions arranged in a three-dimensional configuration that enables omnidirectional light emission. The same circuit board structure that provides electrical connections also defines the spatial arrangement of LEDs, eliminating the need for separate mounting fixtures and reducing device complexity while achieving high light output in multiple directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient heat dissipation, reliable electrical connections, and reduced manufacturing costs, while maintaining high light output and reliability, effectively addressing the limitations of traditional LED lamp designs.
Implementation Method 1
The at least one flat circuit board, or an arrangement of flat circuit boards, eliminates a heatsink casting or assembly and acts as a heatsink to conduct and dissipate heat away from at least one LED
Implementation Method 2
thermal power that must be removed, and dumped into the ambient air by means of natural or forced convection, after conducting the heat away from the high density heat flux at the devices
Data Source
AI summary
A lamp is provided. The lamp includes at least one light emitting diode (LED) and an electronic circuit configured to provide power to the at least one LED. The lamp includes at least one flat circuit board having mounted thereto the at least one LED and the electronic circuit. The at least one flat circuit board acts as a heatsink to dissipate heat from the at least one LED and acts as a plurality of circuit paths for the electronic circuit and the at least one LED.