Flat Coil Manufacturing via Foil Rod Slicing
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Solution Overview
Problem
Existing methods for manufacturing flat coils, such as Cu wire winding and formation on printed circuit boards, face challenges with low throughput, high cost, limited design flexibility, and degraded performance, including high resistance and low efficiency.
Innovation Solution
A method involving rolling metal foil lamination onto a carrier roller to form a foil rod, slicing it into thin disks, and processing these disks to create flat coils, which can include additional steps like grinding, passivation coating, and terminal formation, offering design flexibility and potentially lower manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If Cu wire winding approach is used to manufacture flat coil, then the coil can be formed with magnetic core, but the throughput is low and cost is high
Solution Approach 1:
The invention changes the fundamental manufacturing parameter from wire winding to foil rolling and slicing. By using metal foil lamination that is rolled onto a carrier roller and then sliced into thin disks, the process achieves both high throughput and low cost while maintaining manufacturing flexibility.
Solution Approach 2:
The invention replaces the mechanical wire winding process with a foil-based system. The metal foil lamination is rolled onto a carrier roller to form a foil rod, then sliced into thin disks that are processed into flat coils. This substitution eliminates the limitations of wire winding while improving productivity.
2Adaptability or versatility
If Cu wire winding approach is used to manufacture flat coil, then the coil structure is simple, but the shape and diameters are limited and design optimization is difficult
Solution Approach 1:
The invention enables design flexibility by changing from fixed-diameter wire to variable-thickness foil. The metal foil can be rolled to different thicknesses and sliced into disks of varying dimensions, allowing optimization of coil geometry for different applications without complicating the manufacturing process.
3Productivity
If flat coil is formed on printed circuit board by lithography and Cu etching, then mass production is possible, but the coil has high resistance and low Quality-factor
Solution Approach 1:
The invention changes the material form from thin PCB traces to thicker metal foil disks. The foil rod is sliced into thin disks that are then processed into flat coils with substantially equal thickness throughout, providing lower resistance and higher Quality-factor while maintaining mass production capability through the rolling and slicing process.
4Ease of manufacture
If flat coil is formed on printed circuit board, then standardized production is achieved, but manufacturing cost increases
Solution Approach 1:
The invention changes from PCB-based manufacturing to metal foil-based manufacturing. The foil rod can be rolled and sliced into standardized thin disks that are then processed into flat coils, achieving both standardization and cost reduction by eliminating PCB material and processing costs.
Data Source
AI summary
A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.