Flat Conductor Connection Element With Through-Hole Solder Access

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Solution Overview

Problem

The existing methods for connecting flat conductors to electrically conductive structures in limited spaces, such as composite glass panes, often result in inadequate quality control and are limited to using only hot stamps for soldering, making it difficult to verify soldering quality and requiring inefficient processes.

Innovation Solution

A flat conductor connection element with a planar encapsulation layer featuring a through-hole allows for accessible connection and contact surfaces, enabling soldering with various tools and ensuring quality control, while being adaptable for use in thin, flexible configurations suitable for composite panes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a hot stamp is used for soldering the flat conductor through the electrically insulating covering, then the soldering can be performed, but the quality of the soldering cannot be verified and only this specific tool can be used

Engineering Contradiction:
Improvesoldering tool compatibilityVSAvoidsoldering quality verification
Core Design Contradiction:
Adaptability or versatilityVSDifficulty of detecting and measuring

Solution Approach 1:

The electrically insulating covering is segmented by creating an opening that exposes the connection surface, separating the insulation function from the soldering access requirement. This allows different soldering tools to access the connection surface while maintaining insulation coverage elsewhere.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The opening in the electrically insulating covering acts as an intermediary that enables visual access and tool access to the connection surface without compromising the overall insulation. This intermediary structure allows quality verification and versatile tool usage.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Volume of moving object

If the flat conductor is embedded in a thermoplastic adhesive layer between glass panes, then space is optimized, but the connection surface becomes inaccessible for soldering

Engineering Contradiction:
Improvespace utilizationVSAvoidconnection surface accessibility
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The electrically insulating covering provides localized insulation while incorporating an opening at the connection region. This local modification maintains the space-efficient embedding in the adhesive layer while creating a specific access path for soldering operations.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The opening in the insulating covering creates a vertical access dimension through the insulation layer, allowing soldering tools to reach the connection surface from the front side without requiring removal from the embedded position in the adhesive layer.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If the connection surface is covered by electrically insulating material, then electrical insulation is provided, but quality control of soldering is impaired

Engineering Contradiction:
Improveelectrical insulationVSAvoidsoldering quality assessment
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The electrically insulating covering is segmented with an opening that exposes the connection surface. This segmentation maintains electrical insulation for the conductor body while providing visual and physical access to the connection surface for quality control.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The connection surface may be provided with a soldering compound that has distinct visual characteristics, making it easily identifiable and allowing for visual quality control of the soldering process through the opening in the insulating covering.

Inventive Principle:
Principle #32Color changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables reliable and high-quality soldering of flat conductors to electrically conductive structures, allowing for better quality control and the use of diverse soldering tools, while maintaining flexibility and economic production.

Implementation Method 1

a planar encapsulation layer (15) made of an electrically insulating material, which surrounds the conductor (4) at least in a conductor section (5) having the first connection region (9)

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Implementation Method 2

soldering the connection surface (13) to the electrically conductive structure (3)

Methodology Applied
Scientific EffectSoldering: Soldering

Data Source

PatentUS12068553B2Flat conductor connection element
Publication Date: 2024.08.20 SAINT GOBAIN SEKURIT FRANCE
  • US12068553B2 patent drawing
  • US12068553B2 patent drawing
  • US12068553B2 patent drawing

AI summary

A flat-conductor connection element for an electrically conductive structure applied to a pane, includes at least one conductor, containing a flat conductor, having a first connection region at a first end and a second connection region at a second end, the first connection region having a connection surface for electrically connecting to the electrically conductive structure and having a contact surface opposite the connection surface for contact with a soldering tool; an encapsulation layer made of an electrically insulating material, which encapsulation layer surrounds the conductor at least in a conductor portion containing the first connection region, the encapsulation layer having a through-hole, through which the connection surface and the contact surface of the first connection region are accessible, the first connection region of the conductor being within the through-hole in a view perpendicularly through the plane of the encapsulation layer.