Flat Conductor Connector Terminal Design for Insert Molding Clearance
Solution Overview
Problem
Existing flat conductor electric connectors face challenges in densely arraying terminals while ensuring sufficient clearance for the die pin during insert molding, leading to weak die pin strength and inability to maintain the original dense terminal array configuration.
Innovation Solution
The design includes terminals with a narrow portion that forms an opening, allowing a thicker die pin to be used, enabling dense terminal arraying without narrowing the terminal area or increasing the terminal pitch, and featuring a recessed portion at the side edge of the extending portion to accommodate the die pin during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If terminals are densely arrayed to reduce connector size, then the connector size is reduced, but the clearance for the die pin during insert molding becomes insufficient
Solution Approach 1:
The terminal structure is designed with different widths at different locations: a narrow portion at the extending portion end and a wider holding target portion at the other end. This local variation in dimensions allows the terminal to be densely arrayed at the holding target portion while providing sufficient clearance at the narrow portion for the die pin during insert molding.
Solution Approach 2:
The invention utilizes the width dimension of the terminal to create the narrow portion, allowing the die pin clearance to be achieved in the width direction rather than requiring increased spacing in the length direction. This enables dense terminal arraying while maintaining manufacturing feasibility.
2Quantity of substance
If the terminal width is reduced to increase terminal density, then the terminal array density is improved, but the structural strength of the terminal is reduced
Solution Approach 1:
The terminal is designed with a narrow portion only at the extending portion end where space is constrained, while the holding target portion and mounting portion maintain sufficient width for structural strength. This localized narrowing achieves high terminal density without compromising overall terminal strength.
Solution Approach 2:
The terminal is segmented into different functional portions with different width characteristics: the narrow portion for clearance, the holding target portion for strength and positioning, and the mounting portion for circuit board attachment. This segmentation allows each portion to be optimized for its specific function.
3Ease of manufacture
If the terminal pitch is increased to ensure die pin clearance, then the manufacturing feasibility is improved, but the connector size increases
Solution Approach 1:
Instead of increasing the overall terminal pitch, the invention creates clearance locally at the narrow portion of each terminal. This allows the terminals to remain closely spaced while providing sufficient die pin clearance at the specific location where the molding process requires it.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a strong die pin can be used for insert molding, allowing for dense terminal arraying while maintaining proper terminal positioning without the need for reducing the terminal area or increasing the pitch, thus enhancing the connector's structural integrity and manufacturing efficiency.
Implementation Method 1
a housing holding, by insert molding, the multiple terminals arrayed in a terminal array direction
Data Source
AI summary
A flat conductor electric connector mounted on a circuit board and electrically connected to a front end side portion of a band-shaped flat conductor extending in a front-back direction, comprising: multiple terminals in such a shape that metal plate members are bent in a plate thickness direction thereof; and a housing holding, by insert molding, the multiple terminals arrayed in a terminal array direction which is a band width direction, wherein each of the multiple terminals has, at least at one end portion in the front-back direction, a holding target portion held on the housing and an extending portion extending from the housing and formed with a mounting portion to be mounted on the circuit board by soldering, and the holding target portions adjacent to each other and the extending portions adjacent to each other are arrayed and positioned in the terminal array direction. The mounting portion includes an opening to receive a pin of a molding device.