Semiconductor Packaging Structure With Flat-Core Interconnects
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Solution Overview
Problem
The development of panel-level packaging faces challenges in achieving high component density due to burrs or undulations on the lateral surfaces of copper blocks used as electrical connection components, which hinder the reduction of spacing between the copper block and neighboring dies.
Innovation Solution
A semiconductor packaging structure that includes an encapsulation layer, a die, and an electrical connection component with a non-metal core and a metal film. The electrical connection component is designed to have a flat lateral surface, allowing for closer spacing with neighboring semiconductor elements without causing electrical shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If copper blocks are used as electrical connection components, then electrical connectivity is achieved, but burrs or undulations on lateral surfaces prevent reduced spacing between components
Solution Approach 1:
The electrical connection component uses a composite structure with a non-metal core (such as silicon or glass) and a metal film layer (such as copper or aluminum) on its surface. This composite material approach allows the component to maintain flat lateral surfaces from the non-metal core while providing electrical conductivity through the metal film, thereby eliminating burrs and undulations that prevent reduced spacing between components.
2Productivity
If copper blocks are used for electrical connections, then connectivity between metal layers is established, but surface irregularities increase spacing requirements and reduce component density
Solution Approach 1:
By using a non-metal core with flat lateral surfaces covered by a conductive metal film, the invention enables precise spacing control between electrical connection components. The flat surfaces allow components to be positioned closer together, increasing component density and productivity in panel-level packaging applications.
3Reliability
If traditional copper blocks are fabricated, then electrical connection is provided, but lateral surface irregularities make it difficult to achieve high component density
Solution Approach 1:
The composite structure maintains reliable electrical connection through the conductive metal film while the flat non-metal core provides precise geometric control. This enables higher component density without compromising electrical connection reliability, as the metal film ensures conductivity while the non-metal core prevents surface irregularities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the electrical connection component with a flat surface facilitates higher component density in panel-level packaging by preventing burrs or undulations, thus reducing the horizontal spacing between components and enhancing packaging efficiency.
Implementation Method 1
The electrical connection component includes a non-metal core and a metal film located on a surface of the non-metal core. The first metal layer is electrically connected with the second metal layer through the electrical connection component.
Data Source
AI summary
A semiconductor packaging structure includes an encapsulation layer, a die, a first metal layer, a second metal layer and an electrical connection component. The die is disposed in the encapsulation layer. The first metal layer and the second metal layer are disposed in the encapsulation layer. The first metal layer and the second metal layer are disposed on opposite sides of the die, respectively. The electrical connection component is disposed in the encapsulation layer. The first metal layer is electrically connected with the second metal layer through the electrical connection component. The electrical connection component includes a non-metal core and a metal film located on a surface of the non-metal core.