Flat Diode Thermal Dissipation in Solar Connection Devices
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Solution Overview
Problem
Traditional connection devices for solar modules experience high losses and poor heat dissipation due to the limited thermal conductivity of rounded diodes, especially at high power levels, which restricts their ability to handle higher electrical powers.
Innovation Solution
A connection device with a flat diode configuration and a thermal conduction structure, including a substrate arrangement and encapsulation material, enhances thermal conductivity by efficiently dissipating waste heat through a large surface area, allowing for higher power handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rounded diode configuration is used, then the device structure is simple, but the thermal conductivity is poor and heat dissipation is limited
Solution Approach 1:
The patent changes the geometric parameters of the diode from a rounded configuration to a flat configuration with enlarged contact surfaces. This parameter change increases the thermal contact area between the diode and the substrate arrangement, thereby improving thermal conductivity and heat dissipation capability while maintaining manufacturing simplicity
Solution Approach 2:
The patent transitions from a rounded (3D spherical) diode configuration to a flat (2D planar) configuration. This dimensional change increases the surface area in contact with the thermal conduction structure, enabling more efficient heat dissipation without significantly increasing the overall device complexity
2Device complexity
If a rounded diode configuration is used, then the device complexity is low, but the power handling capability is limited
Solution Approach 1:
By changing the physical parameters of the diode (flat configuration with enlarged contact surfaces), the patent improves the thermal management of the device. This enables the diode to handle higher electrical powers by effectively dissipating the heat generated during high-power operation, without significantly increasing device complexity
Solution Approach 2:
The patent converts the harmful effect of heat generation during high-power operation into a manageable parameter by implementing an optimized thermal conduction structure. The flat diode configuration with enlarged contact surfaces transforms the heat dissipation challenge into an opportunity for improved thermal management, enabling higher power handling capability
3Volume of moving object
If the diode contact area with thermal conduction structure is small, then the device structure is compact, but the thermal conductivity is poor
Solution Approach 1:
The patent optimizes the contact area parameter between the diode and the thermal conduction structure by implementing a flat diode configuration with enlarged contact surfaces. This parameter change increases the thermal conductivity without significantly increasing the overall device volume, as the enlarged contact area is achieved through planar expansion rather than volumetric growth
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved thermal conductivity enables better dissipation of waste heat, allowing the connection device to handle higher electrical powers effectively, even under high load conditions.
Implementation Method 1
the thermal conduction structure is configured to dissipate thermal energy from the diode
Implementation Method 2
which have to be dissipated in the form of heat to the outside of the connection device
Data Source
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AI summary
A connection device for connecting at least one electrical conductor (13) to at least one connecting lead (11, 12) comprises a connector housing (2) and an intermediate connection arrangement (3) arranged in the connector housing (2) having a first connection area (31) for connecting the connecting lead (11, 12) and a second connection area (32) for connecting the electrical conductor (13). The intermediate connection arrangement (3) comprises a substrate arrangement (4, 6) having an electrical conductor structure (41, 61), a thermal conduction structure (7, 10, 41, 45, 61) and at least one diode (5). The diode (5) is configured as a flat diode having two substantially flat opposing main faces (51, 52). The diode is connected to the electrical conductor structure (41, 61) and is connected to the thermal conduction structure (7, 10, 14, 41, 45, 61) by at least one of its main faces (52). The conductor structure (41, 61) is used for the electrical connection of the first connection area (31) and the second connection area (32), whereas the thermal conduction structure (7, 10, 14, 41, 45, 61) is configured to dissipate thermal energy from the diode (5). A higher thermal conductivity for the diode is thereby achieved inside the connection device for dissipating waste heat.