Flat Glass Substrate for High-Frequency Electronics
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Solution Overview
Problem
Current materials used in electronic components, such as silicon and ceramics, have high dielectric constants and losses, limiting their suitability for high-frequency applications, and existing glasses have high dielectric constants and losses or are not economically producible as flat glass.
Innovation Solution
The use of a flat glass with a composition comprising oxides of network formers like SiO2 and B2O3, with limited alkali content and specific ratios, to achieve a low dielectric constant and loss factor, suitable for high-frequency applications and economically producible as a substrate for electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If silicon or ceramics are used as substrates for electronic components, then mechanical strength and thermal stability are improved, but dielectric constant and dielectric loss increase, limiting high-frequency performance
Solution Approach 1:
The patent changes the chemical composition parameters of the glass substrate by precisely controlling the content ranges of SiO2 (65-80 wt%), B2O3 (10-20 wt%), Al2O3 (5-15 wt%), and other oxides, along with specific ratios between them, to achieve optimal dielectric properties with low dielectric constant (3.5-4.5) and low dielectric loss tangent (<0.005 at 10 GHz) while maintaining mechanical strength and thermal stability
Solution Approach 2:
The patent uses a composite glass material system combining multiple oxide components (SiO2, B2O3, Al2O3, Na2O, K2O, CaO, MgO, etc.) in specific proportions to create a substrate that integrates the advantages of different materials: low dielectric loss from borosilicate glass, mechanical strength from aluminosilicate network, and thermal stability from the overall composition balance
2Loss of energy
If existing glass compositions are used to reduce dielectric constant and loss, then high-frequency performance is improved, but manufacturing complexity and cost increase due to difficult production processes
Solution Approach 1:
The patent optimizes the glass composition parameters to fall within specific ranges that enable conventional manufacturing processes: SiO2 (65-80 wt%), B2O3 (10-20 wt%), Al2O3 (5-15 wt%), with controlled contents of Na2O (0.1-5 wt%), K2O (0.1-3 wt%), CaO (0.1-5 wt%), and MgO (0.1-3 wt%), ensuring the glass can be produced using standard float glass or melting processes without requiring specialized equipment or complex multi-step procedures
3Ease of manufacture
If alkali content is increased to improve glass processing and tempering, then ease of manufacture is improved, but dielectric constant and dielectric loss increase, reducing high-frequency performance
Solution Approach 1:
The patent precisely controls the alkali metal oxide content parameters: Na2O (0.1-5 wt%), K2O (0.1-3 wt%), maintaining them at low levels to ensure low dielectric loss tangent (<0.005 at 10 GHz), while still providing sufficient alkali content for acceptable glass processing and tempering properties, representing an optimized balance between electrical performance and manufacturability
Data Source
AI summary
The invention relates to the use of a flat glass in electronic components, for example as a substrate or interposer or superstrat, particularly for high-frequency applications.