Flat Heat Pipe Cooling Structure for Thin Portable Devices
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Solution Overview
Problem
Conventional heat sinks for portable electronic devices are too thick due to their design, which hinders their use in thin and lightweight devices like smartphones and tablets, as they require additional thickness for recessed portions and grooves to accommodate heat pipes, leading to increased thermal resistance and reduced heat transfer efficiency.
Innovation Solution
A cooling structure that integrates a flat heat pipe compressed in the thickness direction of the device case, with one end sandwiched between the heat-generating component and the heat sink, and the other end in close contact with the heat sink, filled with a thermal conductive material to enhance heat transfer and radiation, reducing thermal resistance and allowing for thinner device designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heat sink with recessed portion and groove is used to accommodate heat pipe, then heat transfer capability is improved, but device thickness increases
Solution Approach 1:
The heat sink is integrated directly into the case structure, merging two previously separate components (heat sink and case) into one unified structure. This eliminates the need for additional recessed portions and grooves, allowing the heat pipe to be accommodated within the case thickness without increasing overall device thickness.
Solution Approach 2:
The heat pipe is nested within the case structure by utilizing the integrated heat sink, where the heat pipe fits into the available space within the case thickness rather than requiring additional external recesses. This nesting approach allows efficient heat transfer while maintaining a thin profile.
2Temperature
If groove structure is added to accommodate circular heat pipe, then heat transfer efficiency is improved, but device thickness increases
Solution Approach 1:
The case structure and heat sink are merged into a single integrated component, eliminating the need for separate groove structures. The heat pipe is accommodated within the integrated heat sink area, maintaining efficient thermal contact without requiring additional thickness.
Solution Approach 2:
The heat pipe configuration is changed from a traditional circular cross-section requiring grooves to a shape that can be accommodated within the integrated heat sink structure. The integration allows the heat pipe to be positioned optimally for heat transfer without being constrained by groove geometry, effectively changing the spatial parameters of the thermal management system.
3Length of stationary object
If heat sink is made thinner to reduce device thickness, then portability is improved, but heat transfer capability deteriorates
Solution Approach 1:
By integrating the heat sink into the case structure, the design maximizes the use of available space within the case thickness. The heat sink area is expanded laterally within the case footprint rather than increasing thickness, maintaining thin profile while preserving heat transfer capability through optimized thermal pathways.
Solution Approach 2:
The heat dissipation strategy transitions from increasing thickness (vertical dimension) to expanding the heat sink area within the case footprint (horizontal dimensions). The integrated heat sink utilizes the case's lateral space more effectively, compensating for reduced thickness by increasing surface area for heat radiation in other dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively lowers the temperature of hot spots in portable electronic devices by improving heat transfer and radiation properties, reducing the device's thickness and weight while maintaining performance, and can be integrated into the device case using insert molding for enhanced cooling effects.
Implementation Method 1
a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end of the flat heat pipe is attached by being sandwiched between the heat-generating component and the heat sink while another end of the flat heat pipe is in close contact with the heat sink
Implementation Method 2
heat is transferred to the heat sink from the heat-generating component via the heat pipe
Implementation Method 3
a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component
Implementation Method 4
heat is transferred to the heat sink from the heat-generating component via the heat pipe and in turn radiated to the outside from the heat sink through the front cover or the rear cover
Data Source
AI summary
A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.