Flat Heat Pipe Thermal Management for Mobile Terminals

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Solution Overview

Problem

Conventional heat dissipation structures in mobile terminals, such as smartphones and tablets, fail to effectively diffuse heat generated by CPUs, leading to temperature restrictions and heat spots, especially due to space constraints and the inability to install traditional pipe-shaped heat pipes in thin chassis.

Innovation Solution

The implementation of flat-type heat pipes, including sheet-shaped and flattened heat pipes, is positioned between the rear surface of a touch panel and a substrate or battery pack, and between a rear cover and a substrate, allowing for efficient heat diffusion across a larger area within the chassis, utilizing dents on heat dissipation plates for installation and ensuring thermal connections through wider heat-receiving and dissipation portions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a pipe-shaped heat pipe is used for heat dissipation, then heat diffusion capability is improved, but the device cannot be installed in thin chassis due to diameter requirements

Engineering Contradiction:

Improveheat diffusion capabilityVSAvoidchassis thickness

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent transforms the traditional three-dimensional pipe-shaped heat pipe into a two-dimensional flat-type heat pipe structure. This dimensional reduction allows the heat pipe to be installed within the limited thickness of thin chassis while preserving heat diffusion functionality through a flattened geometry that maintains sufficient thermal contact area.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent employs a flat-type heat pipe with a thin-film structure that can be flexibly integrated into the chassis. This thin-film design enables installation in space-constrained environments while maintaining effective thermal management through the flattened configuration that conforms to the chassis interior.

Inventive Principle:

Principle #30Flexible shells and thin films

2Ease of manufacture

If a flat-type heat pipe is used to fit in thin chassis, then installation feasibility is improved, but heat diffusion area is reduced

Engineering Contradiction:

Improveinstallation feasibilityVSAvoidheat diffusion area

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The flat-type heat pipe is designed to serve multiple functions: it provides heat diffusion capability while simultaneously acting as a space-efficient component that fits within thin chassis. The structure integrates thermal management functionality with the spatial constraints of modern mobile devices, achieving both installation feasibility and heat dissipation effectiveness.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent modifies the geometric parameters of the heat pipe by flattening its structure, changing from a cylindrical form to a planar configuration. This parameter change reduces the thickness dimension to enable installation in thin chassis while maintaining or expanding the surface area for heat diffusion through optimized flat geometry.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If CPU heat generation is controlled to prevent overheating, then temperature control is improved, but CPU capabilities are underutilized

Engineering Contradiction:

Improvetemperature controlVSAvoidCPU capabilities

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The flat-type heat pipe acts as an intermediary thermal management component between the CPU and the chassis. It efficiently transfers heat away from the CPU to the chassis structure, enabling the CPU to operate at higher temperatures and maintain full capabilities without overheating, thus resolving the trade-off between temperature control and performance utilization.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables effective heat dissipation across a larger area, preventing temperature increases that could underclock CPUs and maintaining their primary capabilities, while allowing for installation in thin chassis without protruding beyond the chassis boundaries.

Implementation Method 1

a flat-type heat pipe, such as flattened heat pipe and sheet-shaped heat pipe, is disposed between a rear surface of a touch panel and a substrate or between the one and a battery pack

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

a favorable heat diffusion from a heat generating component such as a CPU to a large area on the chassis can be achieved through these heat pipes

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9568965B2Mobile terminal

Publication Date: 2017.02.14 TOSHIBA HOME TECHNOLOGY

AI summary

Provided is a mobile terminal capable of allowing a heat generating component such as a CPU to make best use of its capabilities. The sheet-shaped heat pipe, according to the present invention, is provided either between the rear surface of the touch panel and motherboard, or between the one and the battery pack. In this case, since the sheet-shaped heat pipe is arranged opposite to the rear surface of the touch panel which is a part of the chassis of the mobile terminal, a favorable heat diffusion from the heat generating components such as the CPU to a large area on the chassis can be achieved through these sheet-shaped heat pipe, thus allowing the heat generating component such as the CPU to make best use of its capabilities.