Flat Heat Transfer Plates for Mobile Device Cooling
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Solution Overview
Problem
Conventional heat transfer solutions for mobile devices, such as heat sinks and heat pipes, occupy significant space and are limited in forming non-linear shapes, which hampers effective cooling of electronic components.
Innovation Solution
A heat transfer device comprising a first and second plate with an internal reservoir containing a thermal transfer fluid, where a wing extends from each plate to couple with electronic components, allowing heat transfer to the fluid and dissipation through the plates, enabling flexible shaping and efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks and heat pipes are used to cool electronic components, then heat dissipation is achieved, but significant space is occupied within the mobile device
Solution Approach 1:
The patent combines the heat dissipation function with the structural housing of the mobile device. The housing itself serves as a heat sink, eliminating the need for separate heat dissipation components. This merging of functions reduces the overall space occupied while maintaining effective heat dissipation from the electronic components.
2Temperature
If heat pipes are used for heat transfer, then heat dissipation is achieved, but they are constrained in forming non-linear shapes
Solution Approach 1:
The heat dissipation system is segmented into multiple heat transfer channels within the housing structure. These channels can be configured in non-linear paths, allowing heat to be transferred from various locations throughout the device to external dissipation points. This segmentation enables flexible shaping to accommodate different component orientations and non-linear heat flow paths.
3Temperature
If conventional heat sinks are used, then heat dissipation is provided, but they take up significant space within the mobile device
Solution Approach 1:
The housing structure serves multiple functions simultaneously: it provides structural support, encloses electronic components, and acts as a heat dissipation system. By making the housing multi-functional, the patent eliminates the need for dedicated heat sink components, thereby reducing the space occupied while maintaining effective cooling.
4Temperature
If heat pipes are used, then heat transfer is achieved, but they are limited in their ability to be formed into non-linear shapes
Solution Approach 1:
The heat transfer system utilizes three-dimensional pathways within the housing structure, allowing heat to travel through multiple dimensions rather than being constrained to linear paths. This dimensional approach enables the creation of complex, non-linear heat transfer routes that adapt to the spatial arrangement of electronic components while maintaining efficient heat transfer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient and space-effective cooling mechanism for mobile devices, allowing for the formation of non-linear shapes to accommodate various electronic component orientations, thereby enhancing heat dissipation and reducing device size.
Implementation Method 1
The first wing provides heat transfer from the first electronic component to the thermal transfer fluid via the first plate. The thermal transfer fluid moves within the internal reservoir dissipating transferred heat through the first and second plates toward the exterior of the mobile device.
Data Source
AI summary
A heat transfer device, a mobile device, and a manufacturing method for manufacturing a heat transfer device. The heat transfer device includes a first plate having a first inner surface and a first outer surface. A second plate has a second inner surface and a second outer surface. The first plate and the second plate are at least partially bonded such that an internal reservoir is defined between the first inner surface and the second inner surface. A thermal transfer fluid is contained within the internal reservoir and is in fluid contact with both the first inner surface and the second inner surface. A first wing extends from the first plate. The first wing is adapted to be coupled to a first electronic component that requires cooling. The first wing provides heat transfer from the first electronic component to the thermal transfer fluid via the first plate.