Flat Lighting Device Thermal Interface and Optical Structure
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Solution Overview
Problem
Conventional LED lamps have limitations in optical and thermal performance due to the complexity of components, which affects their ability to efficiently generate and distribute light while dissipating heat effectively.
Innovation Solution
A lighting device with a solid state light source mounted on a carrier, where a cover member with a thermal interface directs heat away from the light source and incorporates an optical structure to manage light distribution, reducing the number of components and enhancing both thermal and optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED lamps use multiple components (printed circuit board, bulb, heat spreader, heat fins, metal housing, cap), then the lamp can perform all necessary functions (light generation, heat dissipation, protection), but the device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent combines multiple functions into a single integrated LED module that includes the printed circuit board, LED array, heat dissipation structure, and protective housing as one unified component. This merging reduces the number of separate components while maintaining all necessary functions of light generation, heat dissipation, and protection.
Solution Approach 2:
The LED module is designed as a universal component that performs multiple functions simultaneously: generating light, dissipating heat through integrated heat sinks and fins, providing structural support, and offering protective enclosure. This multi-functionality eliminates the need for separate dedicated components for each function.
2Reliability
If conventional LED lamps use multiple separate components, then each component can be optimized for its specific function, but the ease of manufacture decreases and assembly complexity increases
Solution Approach 1:
The patent integrates the printed circuit board, LED array, heat dissipation structures, and protective housing into a single manufactured unit. This merging simplifies the manufacturing process by reducing the number of assembly steps and quality checks required, while each functional element remains optimized for its specific purpose within the integrated design.
3Device complexity
If LED lamps use reflector-based arrangements to reduce components, then the device complexity decreases, but the optical performance is limited and heat dissipation becomes insufficient for high lumen lamps
Solution Approach 1:
The patent implements localized optical control elements positioned adjacent to individual LED sources, allowing each LED's light output to be independently optimized and directed. This local quality approach maintains high optical performance by preserving the intimate relationship between each LED and its control element, even within an integrated low-component design.
4Ease of manufacture
If conventional LED lamps arrange the printed circuit board horizontally or at an angle to the longitudinal axis, then the manufacturing is straightforward, but the optical distribution and heat dissipation efficiency are reduced
Solution Approach 1:
The patent repositions the printed circuit board and LED array from traditional horizontal or angled orientations to a vertical arrangement along the longitudinal axis of the lamp. This dimensional change optimizes both light distribution patterns and heat dissipation pathways, allowing heat to travel vertically through integrated heat sinks while light is efficiently directed along the lamp's length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved heat transfer and optical performance, enabling a more efficient and cost-effective lighting device with a uniform luminous intensity distribution, suitable for various applications including retrofitting incandescent lamps.
Implementation Method 1
a lighting device comprising a solid state light source
Implementation Method 2
a thermal interface exists between the carrier and the cover member and the thermal interface is arranged to transmit there through a majority of the heat transmitted into the carrier from the light source
Implementation Method 3
the light-transmitting part of the cover member comprises an optical structure adapted to direct emitted light from the solid state light source out of the lighting device
Implementation Method 4
the light-transmitting part of the cover member comprises an optical structure adapted to direct emitted light from the solid state light source out of the lighting device
Data Source
AI summary
The present invention relates to a flat lighting device (1) comprising a carrier (2) including a thermally conductive layer (7), at least one solid state light source (3) arranged on a front side of the carrier (2), and an electrically insulating cover member (5a, 5b) in thermal contact with said front side and a back side opposite said front side. The cover member (5a, 5b) is adapted to transfer heat from said carrier (2) out of the lighting device. The cover member (5a, 5b) comprises an optical structure (4) arranged on the carrier (2) in front of the at least one light source (3) and adapted to direct the light emitted by the at least one solid state light source (3).