Laser Cutting of Flat Material With Vacuum Holding
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Solution Overview
Problem
The handling, fixing, and processing of thin and flexible flat materials, such as anode and cathode foils used in the electronics industry, are complex due to their thin and flexible design, leading to challenges in producing cut pieces safely and reliably.
Innovation Solution
A processing device equipped with a holding device for tensioning the flat material to prevent bending, a laser device for precise cutting without mechanical stress, and a transport system for handling cut pieces and offcuts, utilizing vacuum holding and clamping mechanisms to maintain material position and facilitate safe handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If mechanical cutting methods (sawing, punching) are used on flat material, then cutting can be performed, but mechanical stress is placed on the flat material causing distortion and overlap
Solution Approach 1:
The patent replaces mechanical cutting methods (sawing, punching) with laser cutting technology. The laser beam cuts the flat material without physical contact, eliminating mechanical stress and preventing distortion or overlap of the thin, flexible material. This substitution of mechanical systems with optical/thermal systems resolves the contradiction between cutting capability and manufacturing precision.
2Ease of operation
If the flat material is left unclamped during processing, then handling is simple, but the flexurally flexible material forms unwanted distortions or overlaps
Solution Approach 1:
The holding device is divided into multiple independent holding elements (vacuum nozzles) distributed across the surface. These segmented elements can locally secure different regions of the flat material without requiring complete clamping, maintaining simplicity while preventing distortion in critical areas.
Solution Approach 2:
The patent employs a vacuum holding device that uses pneumatic pressure (vacuum suction) to secure the flat material. The vacuum nozzles create localized holding forces that prevent distortion without mechanical contact or complex clamping mechanisms, resolving the contradiction between ease of operation and shape maintenance.
3Manufacturing precision
If vacuum holding is used to secure the flat material, then the material can be held in defined position, but the laser beam path may be blocked by the holding device
Solution Approach 1:
The holding device is designed with a minimal profile in the z-direction (beam path direction), placing the vacuum nozzles and support structures in a plane that does not obstruct the laser beam's path. This dimensional arrangement allows the holding function to be performed without interfering with the optical path, resolving the contradiction between positioning accuracy and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe, reliable, and reproducible cutting of flat materials into precise cut pieces with minimal distortion, reducing mechanical stress and thermal load, while ensuring easy handling and positioning of cut pieces and offcuts.
Implementation Method 1
The holding device is preferably designed as a vacuum holding device for sucking in the flat material. The nozzles are arranged such that they suck in the flat material, and in particular the cut pieces.
Implementation Method 2
The laser device is configured such that a laser beam emitted by the laser device is directed onto the flat material and energy is introduced into the flat material at an impact point, such that the flat material is cut at the impact point.
Implementation Method 3
energy is introduced into the flat material at an impact point, such that the flat material is cut at the impact point
Data Source
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AI summary
The invention relates to a processing device (10) for processing flat material (12) extending along a material plane (11), the processing device (10) comprising: at least one holding device (200) for holding the flat material (12), at least one clamping device (400) for fixing the flat material (12) and for clamping the flat material (12) along the material plane (11), at least one laser device (600) for cutting at least one section (1) from the flat material (12), wherein the holding device (200) is designed such that, after the laser cutting, the at least one section (1) is held by the holding device (200); and a method.