Flat Package Surface Contacts for Thinner Semiconductor Packaging
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Solution Overview
Problem
Conventional flat packages have a complex and costly manufacturing process and a thick overall thickness that prevents them from fitting into certain electronic products.
Innovation Solution
The flat package design omits forming vias in the molding layer and uses conductive contacts on the cover layer to directly connect with die pads, reducing thickness and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed in the molding layer to connect die pads to redistribution layer, then electrical connection is achieved, but the overall package thickness increases
Solution Approach 1:
The patent extracts the conductive pathway from the traditional via-in-molding-layer structure and relocates it to the surface of the molding layer. Conductive contacts are formed directly on the molding layer surface, eliminating the need for deep vias and reducing package thickness while maintaining electrical connection functionality.
Solution Approach 2:
The patent transitions from a vertical via-based connection (through the molding layer thickness) to a surface-based conductive contact structure. By moving the conductive pathway to the surface dimension rather than through the thickness dimension, the package overall thickness is reduced while electrical connectivity is preserved.
2Reliability
If multiple manufacturing steps (metallic covering layer sputtering, opening formation, plasma treatment, metallic layer removal) are used to create circuit layouts, then electrical connections are established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the complex multi-step manufacturing process (metallic covering layer sputtering, opening formation, plasma treatment, metallic layer removal) by directly forming conductive contacts on the molding layer surface. This simplifies the manufacturing process while achieving the same electrical connection function.
Solution Approach 2:
Instead of forming conductive pathways by removing material (creating openings and removing metallic layers), the patent inverts the approach by directly forming conductive contacts on the surface. This reverses the conventional manufacturing sequence and significantly reduces process complexity.
3Reliability
If conventional manufacturing processes are used, then electrical connections are achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent extracts the essential function of electrical connection from the complex conventional manufacturing process and achieves it through direct formation of conductive contacts on the molding layer surface. This eliminates time-consuming steps like metallic covering layer sputtering, opening formation, and plasma treatment, thereby improving manufacturing efficiency.
Data Source
AI summary
A flat package includes a die, a cover layer, multiple conductive contacts, and a dielectric protection layer. The cover layer includes a molding layer. The molding layer covers the die yet exposes multiple pads on the die. The conductive contacts are formed on a surface of a molding layer facing a same side as the pads, and the conductive contacts are electrically connected to the pads respectively. The dielectric protection layer partially covers surfaces of the conductive contacts and of the molding layer. The flat package can be easily manufactured, as manufacturing the flat package consumes little time and cost. The flat package is small in its overall size, allowing the flat package to fit into a product for use.