Flat Panel Electrode Bonding Position Correction
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Solution Overview
Problem
Conventional component bonding methods for flat panel displays face challenges in achieving high precision due to external factors affecting electrode alignment, and the existing position correction methods based on recognition marks are inadequate for miniaturized components with tight tolerances.
Innovation Solution
A component bonding method that involves preliminary press bonding, detecting position displacement after press bonding, and using the calculated displacement as a correction amount to improve alignment precision, with additional detection methods using recognition marks and conductive particle indentations to assess bonding quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If position correction is performed using recognition marks on the component and flat panel, then position alignment is improved, but bonding precision deteriorates due to position displacement between preliminary press bonding and press bonding processes
Solution Approach 1:
The patent performs press bonding first to establish the actual bonding position, then uses this result to correct position displacement in subsequent preliminary press bonding operations. This reverses the conventional sequence where preliminary bonding is done first based on mark recognition, ensuring that correction is based on actual bonding outcomes rather than preliminary alignments that may drift.
Solution Approach 2:
The patent implements a feedback mechanism where the position displacement amount calculated from actual bonding positions is fed back to correct the positioning in the next preliminary press bonding process. This closed-loop control ensures that position errors are continuously reduced based on actual bonding results, resolving the contradiction between initial alignment and final bonding precision.
2Adaptability or versatility
If miniaturized components are used, then product integration is improved, but position displacement detection becomes more difficult due to tighter tolerances
Solution Approach 1:
The patent introduces an intermediary calculation method that determines position displacement amounts based on the relative positions of multiple electrodes rather than directly measuring single-point displacements. This intermediary approach amplifies measurable effects and provides more reliable detection for miniaturized components where direct measurement is difficult due to tight tolerances.
Solution Approach 2:
The patent transitions from one-dimensional mark recognition to two-dimensional electrode position analysis by calculating position displacement based on the relative positions of multiple electrodes. This dimensional expansion provides more data points for accurate displacement measurement, making it feasible to detect and correct position errors in miniaturized components with tight tolerances.
Data Source
AI summary
Provided is a component bonding method with higher bonding precision in a process of bonding an electrode of a component to an electrode formed on a flat panel. A preliminary press bonding device includes: a control unit which includes a position displacement amount correction unit to which a position displacement amount after the press bonding process is fed back and which corrects the position displacement on the next component to be preliminarily bonded; and a component position determining unit which determines a position of the component using the fed back correction amount. On the other hand, a press bonding device includes a bonding recognition device for use in the recognition of positions of the electrodes on the flat panel and the component. The bonding recognition device includes a position displacement amount calculating unit which calculates the position displacement amount based on the recognized position information.