Flat Panel Display Substrate Bending Compensation

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Solution Overview

Problem

Flat panel display devices using the active matrix method face issues with bending and reduced reliability due to differences in thermal expansion coefficients between substrates during the sealing process, leading to yield deterioration and increased manufacturing costs.

Innovation Solution

The use of insulating films with specific thermal expansion coefficients on the substrates to compensate for the thermal expansion differences between the non-alkali glass first substrate and soda lime or borosilicate glass second substrate, employing ultraviolet curing sealants and heat treatment to seal the light emitting unit, thereby preventing bending and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If non-alkali glass is used as the first substrate to protect thin film transistors from alkali ion diffusion, then transistor reliability is improved, but manufacturing cost increases

Engineering Contradiction:
Improvetransistor reliabilityVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The substrate system is segmented into two distinct substrates with different material properties: the first substrate uses non-alkali glass for transistor protection, while the second substrate uses soda lime glass for cost-effective sealing, with each substrate optimized for its specific function

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the device structure are assigned different material qualities: the first substrate region requires non-alkali glass for electrical stability, while the second substrate region can use soda lime glass for sealing, allowing cost optimization without compromising transistor performance

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If soda lime glass is used as the second substrate to reduce manufacturing cost, then manufacturing cost decreases, but substrate bending occurs due to thermal expansion differences

Engineering Contradiction:
Improvemanufacturing costVSAvoidsubstrate stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The thermal expansion parameters of the substrate system are balanced by selecting specific glass compositions for each substrate, ensuring that the first and second substrates have compatible thermal expansion coefficients to prevent bending during heat treatment

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The substrate system uses a composite structure of two different glass materials (non-alkali glass and soda lime glass) with carefully selected thermal properties, creating a balanced assembly that resists thermal deformation while maintaining cost effectiveness

Inventive Principle:
Principle #40Composite materials

3Reliability

If heat treatment is applied to cure the ultraviolet curing sealant, then sealing reliability is improved, but substrate bending is caused by thermal expansion differences

Engineering Contradiction:
Improvesealing reliabilityVSAvoidsubstrate shape
Core Design Contradiction:
ReliabilityVSShape

Solution Approach 1:

The thermal expansion parameters of the substrate assembly are optimized by selecting glass materials with matched coefficients, allowing the system to withstand heat treatment temperatures without excessive thermal stress or bending

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The substrate material selection is designed in advance to compensate for thermal expansion differences, creating a pre-balanced system that resists bending during the heat treatment process

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The implementation of insulating films with controlled thermal expansion coefficients effectively mitigates substrate bending, improves yield, and enhances the reliability of flat panel display devices by maintaining structural integrity during heat treatment processes.

Implementation Method 1

In order to cure the sealant, the sealant is subject to irradiation of ultraviolet rays

Methodology Applied
Scientific EffectUltraviolet curing: Photopolymerisation

Implementation Method 2

is heat-treated for about one hour at a temperature of about 230° C.

Methodology Applied
Scientific EffectHeat treatment: Heat Treatment

Implementation Method 3

The heat treatment causes a thermal expansion of the sealed first substrate and second substrate. Because the first substrate and the second substrate are of materials different from each other, there is a drawback in that the sealed first substrate and second substrate are bent in one direction

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS8062914B2Method for fabricating flat panel display device
Publication Date: 2011.11.22 LG DISPLAY CO LTD
  • US8062914B2 patent drawing
  • US8062914B2 patent drawing
  • US8062914B2 patent drawing

AI summary

Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating films. The light emitting unit comprises thin film transistors positioned on the first substrate, a first electrode electrically connecting with the thin film transistors, a second electrode facing the first electrode, and an emission layer or a liquid crystal layer interposed between the first and second electrodes. The second substrate is sealed with the first substrate by an ultraviolet curing sealant, and has a greater thermal expansion coefficient than the first substrate. The insulating films are positioned on one or more surfaces of the first and/or second substrates.