Flat-Surface Passive Component for Thinner 3D Package Bonding
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Solution Overview
Problem
Existing stacked semiconductor packages face challenges in reducing thickness due to the use of solder balls or solder paste connections, leading to increased overall thickness.
Innovation Solution
A passive component with a flat surface made of an inorganic substance, having a surface roughness of equal to or less than 1/1000 of the body portion's thickness, allows for direct bonding with another electronic component, reducing the overall device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls or solder paste are used to connect the first semiconductor package, the second semiconductor package, and the capacitor, then the connection reliability is improved, but the thickness of the entire stacked semiconductor package increases
Solution Approach 1:
The patent removes the solder balls or solder paste from the bonding interface between the passive component and semiconductor packages. By extracting this intermediate bonding material, the thickness contribution of the solder layer is eliminated, allowing direct contact bonding between the flat surface of the passive component and the semiconductor package, thereby reducing overall package thickness while maintaining connection reliability through direct surface contact
Solution Approach 2:
The patent changes the surface roughness parameter of the passive component's bonding surface to be equal to or less than 1/1000 of the body portion thickness or equal to or less than 10 nm. This parameter change enables direct bonding without solder by ensuring sufficient surface flatness for intimate contact, thereby eliminating the need for thick solder layers while maintaining reliable electrical and mechanical connection
2Manufacturing precision
If a flat surface with very low surface roughness is created by polishing the inorganic layer, then the bonding contact between components is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent performs preliminary polishing of the inorganic layer's first main surface during the manufacturing process to achieve the required surface roughness of equal to or less than 1/1000 of the body portion thickness or equal to or less than 10 nm. By preparing the surface in advance with the correct flatness, subsequent bonding operations can proceed directly without requiring additional complex processing steps, thus managing manufacturing complexity through upfront preparation
Solution Approach 2:
The patent specifies a quantitative parameter for surface roughness (equal to or less than 1/1000 of body portion thickness or equal to or less than 10 nm) that balances manufacturing feasibility with bonding performance. This parameter threshold provides a clear manufacturing target that can be achieved through standard polishing processes while ensuring sufficient flatness for direct contact bonding, avoiding the need for excessively complex manufacturing procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a thin-type three-dimensional device by ensuring flat surfaces can be bonded in contact, thereby minimizing the overall thickness of stacked semiconductor packages.
Implementation Method 1
providing a flat surface having a surface roughness of equal to or less than 1/1000 of a thickness of the body portion in a direction orthogonal to the first main surface or equal to or less than 10 nm by polishing the first main surface of the inorganic layer
Data Source
AI summary
A passive component includes a body portion having a first main surface and a passive element at least a part of which is provided inside the body portion. The first main surface at least partially includes a flat surface made of an inorganic substance and having a surface roughness of equal to or less than 1/1000 of a thickness of the body portion in a direction orthogonal to the first main surface or equal to or less than 10 nm.