Flat Plate Heat Conduction Device Segmentation
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Solution Overview
Problem
Conventional heat pipe manufacturing methods are complex and prone to structural damage during the stave process, making it difficult to inspect and maintain the interior structure.
Innovation Solution
A flat plate-shaped heat conduction device is developed, featuring a capillary structure between two plates with a vapor channel outside, allowing for easier inspection and assembly without the stave process, using materials like copper, nickel, or their alloys, and formed through methods such as 3D printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat pipe manufacturing method (circular pipe with powder metallurgy layer) is used, then heat conduction function is achieved, but manufacturing process becomes complicated and interior structure cannot be inspected
Solution Approach 1:
The heat conduction device is divided into two separate plates (first plate and second plate) with the capillary structure formed on one plate and then assembled with the other plate. This segmentation simplifies the manufacturing process by eliminating the need for complex circular pipe construction and powder metallurgy layer formation inside closed pipes, while allowing easy inspection of the capillary structure before final assembly.
2Reliability
If stave process is used to form circular pipe, then heat pipe structure is created, but interior structure may be broken and inspection becomes difficult
Solution Approach 1:
The capillary structure is formed on the first plate before assembly with the second plate, allowing complete inspection of the capillary structure's integrity and configuration before the final sealed assembly is made. This preliminary formation and inspection approach eliminates the risk of damaging the interior structure during subsequent processing, as the capillary structure is already exposed and accessible for verification.
3Reliability
If capillary structure is formed inside closed circular pipe, then heat conduction function is achieved, but inspection and maintenance of capillary structure becomes difficult
Solution Approach 1:
By dividing the heat conduction device into two separate plates with the capillary structure formed on the first plate before assembly, the design enables easy visual inspection and potential maintenance of the capillary structure. The capillary structure remains accessible on the outer surface of the first plate before final assembly, eliminating the need for complex disassembly or destructive testing required in conventional closed pipe designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, prevents structural damage, and enhances the inspection of the capillary structure, resulting in a more reliable and efficient heat conduction device with improved thermal conductivity.
Implementation Method 1
a capillary structure (130) is formed on a space SP between the first plate (110) and second plate (120)
Implementation Method 2
A vapor channel VC is formed on a region of the space SP outside the capillary structure (130)
Data Source
AI summary
A heat conduction device and a manufacturing method thereof are provided. The heat conduction device includes a first plate, a second plate and a capillary structure. The first plate is connected opposite to the second plate. The capillary structure is formed on space between the first plate and the second plate. A vapor channel is formed on a region of the space outside the capillary structure.