Flat-Plate Heat Pipe Manufacturing Method for Thin Profiles

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Solution Overview

Problem

Conventional methods for manufacturing thin heat pipes for electronic devices face challenges in maintaining effective vapor-liquid circulation and heat dissipation due to compression of capillary structures and limited internal space, leading to reduced heat dissipation efficiency and deformation of internal vapor passages.

Innovation Solution

A manufacturing method involving a flat-plate heat pipe formed by overlapping and sealing board bodies with a capillary structure, allowing for vacuuming and filling of working fluid while maintaining a complete vapor passage, which includes steps of providing board bodies, affixing a capillary structure, forming a flat tubular main body, and sealing the air-sucking and water-filling section.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the heat pipe is thinned to reduce device thickness, then the device thickness is reduced, but the capillary structure is compressed and damaged causing loss of function

Engineering Contradiction:
Improveheat pipe thicknessVSAvoidcapillary structure function
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

The heat pipe is divided into multiple layers including first and second capillary structures positioned at different locations. This segmentation allows each capillary structure to perform specific functions independently, preventing the compression damage that would occur in a single-layer thin heat pipe while maintaining overall thinness.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the heat pipe are given different properties - the first capillary structure is positioned to handle liquid return while the second capillary structure handles vapor transport. This local differentiation allows optimized performance in each region without requiring thick uniform walls throughout, enabling thinness while maintaining reliability.

Inventive Principle:
Principle #3Local quality

2Loss of energy

If the heat pipe is thinned to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but the vapor passage is contracted or disappears

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidvapor passage dimension
Core Design Contradiction:
Loss of energyVSLength of stationary object

Solution Approach 1:

The vapor passage is formed by the spatial arrangement and interaction between the first and second capillary structures rather than being a simple linear channel. This dimensional approach allows the vapor passage to maintain adequate cross-sectional area for efficient vapor transport even when the overall heat pipe thickness is reduced.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If conventional thin heat pipe manufacturing is used, then manufacturing simplicity is maintained, but powder filling and sintering cannot be performed effectively

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidpowder filling and sintering effectiveness
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The heat pipe structure is segmented into multiple layers with capillary structures positioned at different levels. This segmentation creates sufficient internal space and structural support to accommodate powder filling and sintering processes even in thin heat pipes, enabling effective manufacturing while maintaining thinness.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables successful vapor-liquid circulation and enhanced heat dissipation in thin heat pipes, maintaining efficient heat transfer even after thinning, thus addressing the limitations of conventional techniques.

Implementation Method 1

a capillary structure (13) serving as a water-sucking wick

Methodology Applied
Scientific EffectCapillary action: Capillary Action

Implementation Method 2

vacuuming the flat tubular main body

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS9987712B2Manufacturing method of flat-plate heat pipe
Publication Date: 2018.06.05 ASIA VITAL COMPONENTS CO LTD
  • US9987712B2 patent drawing
  • US9987712B2 patent drawing
  • US9987712B2 patent drawing

AI summary

A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and water-filling section; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and water-filling section. By means of the manufacturing method of the flat-plate heat pipe, the flat-plate heat pipe can be formed with a thin thickness. After the flat-plate heat pipe is thinned, the flat-plate heat pipe still has a complete vapor passage.