Flat Plate Heat Pipe Sintered Support Layer Design
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Solution Overview
Problem
Conventional flat plate heat pipes face issues with reduced working fluid flow back to the evaporating end due to wick structure limitations, leading to heat-dissipating efficiency deterioration, and have high production costs and reduced operational space due to the need to solder four sides of the casing.
Innovation Solution
A flat plate heat pipe design incorporating a sintered supporting layer between the upper and lower plates, allowing vapor diffusion and increased fluid return paths, and a manufacturing method that presses the pipe to form a flattened shape with only two sides sealed, reducing wall thickness and increasing operational space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wick structure is provided on the inner surfaces of the chamber to enable working fluid circulation, then the working fluid can be distributed and evaporated, but the wick structure limits the vapor diffusion and fluid return paths, reducing heat-dissipating efficiency
Solution Approach 1:
The patent replaces the conventional wick structure with a porous sintered layer formed directly on the inner surfaces of the upper and lower plates. This porous structure provides numerous apertures that enable vapor to diffuse throughout the chamber and allow condensed liquid to return to the evaporating end through multiple pathways, significantly improving heat-dissipating efficiency while maintaining reliable working fluid circulation.
2Reliability
If four sides of the casing are soldered to form a sealed chamber, then the chamber is properly sealed, but the production cost increases and the operational space is reduced
Solution Approach 1:
The patent removes the unnecessary soldering of four sides of the casing and retains only the essential sealing of two opposite sides (the sides containing the working fluid chamber). This extraction of redundant sealing operations reduces production cost and complexity while maintaining adequate chamber sealing for heat pipe operation.
3Reliability
If four sides of the casing are soldered to form a sealed chamber, then the chamber is properly sealed, but the operational space for working fluid is reduced
Solution Approach 1:
The patent eliminates the redundant soldering of four sides and maintains sealing only where necessary (two opposite sides), thereby removing the obstruction caused by excessive sealing structures and maximizing the internal volume available for working fluid circulation and phase change operations.
4Volume of moving object
If the pipe is pressed to form a flattened shape with reduced wall thickness, then the heat pipe becomes more compact, but the structural strength is reduced
Solution Approach 1:
The patent forms porous sintered layers on the inner surfaces of the upper and lower plates of the flattened heat pipe. These porous sintered layers act as reinforcement structures that compensate for the reduced wall thickness, maintaining adequate structural strength while preserving the compact flattened geometry and maximizing internal working fluid space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The sintered supporting layer enhances structural strength and fluid circulation, while the compact design improves heat-dissipating efficiency and reduces production costs by allowing a larger working fluid space and simpler manufacturing.
Implementation Method 1
Since the sintered supporting layer has a number of apertures, vapors of a working fluid can diffuse to fill up the inner space of the flat plate heat pipe
Implementation Method 2
condensed droplets of the working fluid in the heat pipe can flow through the sintered supporting layer
Implementation Method 3
the primary functions of the wick structure 13 are as follows: the amount of heat passing through the wall of the vapor chamber is reduced; the total area for evaporating the working fluid is increased; and the growth of vapor film is prevented
Implementation Method 4
The evaporating surface is brought into contact with a heat source to absorb the heat of the heat source, thereby heating and evaporating the working fluid in the vapor chamber
Implementation Method 5
When the vapor is brought into contact with a cold surface (i.e., the condensing surface), the vapor condenses into liquid to release the latent heat
Implementation Method 6
the vapor condenses into liquid to release the latent heat
Implementation Method 7
Due to gravity and capillary force of the working fluid, the working fluid is distributed in the wick structure 13 inside the chamber 12
Implementation Method 8
Due to gravity and capillary force of the working fluid, the working fluid is distributed in the wick structure 13
Data Source
AI summary
The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.