Semiconductor Package Structure With Flat RDL Posts for 3D Die Integration

The patent applies preliminary action by forming the carrier with pre-defined recesses and cavities before die attachment. These pre-formed structures accommodate the dies and associated materials, preventing deformation and bubble formation during subsequent packaging processes. The recesses are strategically positioned to receive dies, adhesive layers, and encapsulant materials in advance, ensuring proper alignment and preventing harmful defects.

The patent uses the carrier as an intermediary structure that mediates between multiple dies and the final package. The carrier provides a stable base with pre-formed recesses that hold dies in place, and cavities that accommodate encapsulant materials. This intermediary structure prevents direct contact between dies that could cause deformation and provides a controlled environment for assembly, eliminating bubbles and recesses in the final package.

The patent applies segmentation by dividing the package structure into distinct functional zones on the carrier: recesses for dies, cavities for encapsulant materials, and designated areas for adhesive layers. This segmentation allows each die to be precisely positioned in its own recess, maintaining manufacturing precision even as die area is reduced. The segmented structure provides clear boundaries and alignment features that facilitate precise assembly of smaller dies.

The patent applies local quality by providing specialized structures at specific locations on the carrier: recesses with specific dimensions and positions for each die, cavities positioned to accommodate encapsulant materials, and adhesive layers applied only where needed. This localized structuring ensures that each small die receives appropriate support and positioning, maintaining manufacturing precision throughout the package despite reduced overall die area.

The patent applies universality by designing the carrier to perform multiple functions simultaneously: it provides mechanical support for multiple dies, positions dies with pre-formed recesses, accommodates encapsulant materials in cavities, and facilitates electrical connectivity through standardized adhesive layer positions. This multi-functional carrier design enables high integration density while managing complexity through a unified structure that handles all dies and materials consistently.

The patent applies self-service by designing the carrier with self-aligning features: recesses that automatically position dies upon placement, cavities that guide encapsulant material placement, and adhesive layers that secure components in their correct positions. These self-service features reduce the complexity of manual alignment and connection, enabling high integration density through automated or semi-automated processes without requiring complex external alignment mechanisms.