Flattened Gas Sensor Module with Segmented Side Wall Openings
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Solution Overview
Problem
Conventional gas sensor modules face difficulties in detecting gases when mounted in spaces with limited orthogonal length due to restricted gas flow, as the module's design can impede gas passage through its openings.
Innovation Solution
A gas sensor module with a flattened package shape and strategically placed openings in the side wall and cover, allowing for improved gas flow and discharge, even when the module is mounted in tight spaces, along with a manufacturing method involving injection molding and dicing to create these openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gas sensor module is downsized with a flattened shape to be mounted in small spaces, then the module can be mounted in devices with limited space, but gas flow through the opening becomes difficult when the mounting space height is comparable to the module height
Solution Approach 1:
The package is divided into multiple functional surfaces (upper surface, lower surface, and side surfaces) with multiple openings distributed across these surfaces. This segmentation ensures that regardless of the mounting orientation or space constraints, there are always openings available for gas to enter and exit the detection space, maintaining reliable gas detection capability while keeping the module compact.
2Reliability
If multiple openings are formed in the package to enable gas flow, then gas can be introduced into the detection space, but foreign substances may enter through the openings during the dicing process
Solution Approach 1:
The openings are formed in the package structure before the dicing process. This preliminary formation of openings allows for controlled gas flow paths to be established prior to cutting, and the package structure with pre-formed openings can better protect against foreign substance contamination during subsequent manufacturing steps compared to forming openings after dicing.
Data Source
AI summary
A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.