Multi-Layer Flex Assemblies for Head-Wearable Sensor Coupling
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Solution Overview
Problem
Conventional methods for depth mapping in artificial reality systems are imprecise and inefficient, requiring excessive power consumption, processing, and expense.
Innovation Solution
The development of head-wearable devices with forward-facing cameras and illumination sources, combined with flex assemblies that efficiently transport high-speed electrical signals from sensors to a logic board, enhancing depth tracking and sensor communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate flex assemblies are used to connect each sensor to the logic board, then each sensor can be independently connected, but the space requirements and device complexity increase
Solution Approach 1:
The patent combines multiple separate flex assemblies into a single multi-layer flex assembly that integrates multiple signal busses for transporting data from different imaging sensors. This merging reduces the number of separate components, simplifies the overall device structure, and decreases space requirements while maintaining reliable electrical connections between all sensors and the logic board
2Reliability
If multiple separate flex assemblies are used for each sensor, then each sensor connection can be optimized, but the space requirements and manufacturing costs increase
Solution Approach 1:
The patent merges multiple separate flex assemblies into a single multi-layer flex assembly with integrated signal busses, reducing the total number of components that need to be manufactured and assembled. This integration simplifies the manufacturing process while maintaining signal transmission reliability through proper layer design and grounding
Solution Approach 2:
The multi-layer flex assembly is designed to perform multiple functions simultaneously: it transports data from multiple different imaging sensors through separate signal busses, provides grounding, and maintains electrical isolation between different signal paths, all within a single universal component
3Area of stationary object
If a single multi-layer flex assembly is used to combine multiple sensors, then space requirements are reduced, but signal interference and cross-talk may increase
Solution Approach 1:
The patent introduces ground layers as intermediary elements between the signal busses that transport data from different imaging sensors. These ground layers act as electromagnetic shields that prevent cross-talk and signal interference between adjacent signal paths, allowing multiple sensors to be integrated in a compact multi-layer flex assembly without harmful electromagnetic interactions
4Device complexity
If conventional depth mapping methods are used, then implementation is simpler, but precision and efficiency are insufficient
Solution Approach 1:
The patent employs multiple separate imaging sensors (including monochrome and color cameras) that capture different types of data simultaneously. This segmentation of the sensing function allows the system to gather multiple data streams that can be processed together to generate accurate depth maps, improving measurement precision while maintaining manageable system complexity through modular sensor design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the accuracy and efficiency of depth mapping, reducing power consumption and costs while enhancing user movement tracking and environmental awareness in artificial reality systems.
Implementation Method 1
the illumination source includes a plurality of light-emitting diodes (LEDs), and the forward-facing camera is configured to track light emitted by the LEDs
Data Source
AI summary
In one aspect, a head-wearable device includes a body with a housing and a plurality of electrical components arranged in the housing, including a logic board. The head-wearable device is detachably couplable to the housing. The front-facing outer cover includes a first set of components mounted to the front-facing outer surface, each respective component of the first set of components comprising a first set of sensors, and a second set of components mounted to the front-facing outer surface, each respective component of the second set of components comprising a second set of sensors. The head-wearable device includes a first set of flex assemblies configured to communicatively couple a respective sensor of the first set of sensors to the logic board. And the head-wearable device includes a second set of flex assemblies configured to communicatively couple respective components of the second set of second set of components to the logic board.