In Situ Flex Circuit Embossing for Dense Print Head Interconnects
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Solution Overview
Problem
The increasing density of piezoelectric elements in ink jet print heads complicates the manufacturing of electrical interconnects, reducing the available space for ink feed structures and making it challenging to achieve high printing resolution.
Innovation Solution
A method involving the use of a flexible printed circuit with pre-formed, embossed conductive pads that are aligned and deformed under pressure to establish electrical contact with piezoelectric elements, simplifying the manufacturing process and reducing production costs by eliminating a separate pad forming stage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the density of piezoelectric elements is increased to achieve higher printing resolution, then the printing resolution is improved, but the available space for electrical interconnects and ink feed structures decreases
Solution Approach 1:
The patent combines the pad formation process with the assembly process by embossing conductive pads directly onto the flexible circuit during the assembly operation. This merging of operations eliminates the need for separate pad formation steps and allows pads to be created in-situ where needed, effectively utilizing the available space without requiring additional manufacturing steps that would consume time and resources.
Solution Approach 2:
The conductive pads are embossed onto the flexible circuit before final assembly with the piezoelectric elements. This preliminary formation of electrical interconnects allows the pads to be pre-positioned and prepared, reducing the complexity of the subsequent assembly process and enabling higher density arrangements since the pad locations can be precisely predetermined.
2Reliability
If traditional methods of dispensing conductor material individually on each piezoelectric element are used, then electrical connection is achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
Multiple operations are merged into a single embossing step: pad formation, conductor material application, and electrical connection establishment all occur simultaneously during the assembly process. This eliminates the need for separate steps of dispensing conductor material on each element and separately establishing connections, dramatically simplifying the manufacturing process while maintaining reliable electrical connections.
Solution Approach 2:
The flexible circuit itself performs the function of providing electrical interconnects through the embossed conductive pads. The circuit board serves its primary function of electrical connection while also integrating the conductor pathways directly into its structure, eliminating the need for separate conductor materials and simplifying the overall assembly.
3Productivity
If separate pad forming stage is eliminated to simplify manufacturing, then production efficiency is improved, but the precision of pad formation may be compromised
Solution Approach 1:
The embossing process forms conductive pads with precise dimensions and locations before assembly occurs. By pre-forming the pads during the embossing operation, the precise geometric features are established in advance, ensuring accurate pad formation without requiring subsequent separate formation steps. This preliminary action maintains precision while eliminating redundant operations.
Solution Approach 2:
The traditional mechanical dispensing of conductor materials is replaced with an embossing process that uses mechanical pressure and heat to form conductive pathways directly in the flexible circuit material. This substitution of the formation mechanism maintains precision through controlled embossing parameters while simplifying the overall process by eliminating multiple discrete steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the connection to dense transducer arrays, reduces production costs, and enhances the manufacturing efficiency of high-density ink jet print heads, enabling higher printing resolution without compromising the integrity of the print head components.
Implementation Method 1
applying pressure to the flex circuit within the press to deform the plurality of conductive pads
Implementation Method 2
deform the plurality of conductive pads wherein, during deformation of the plurality of conductive pads within the press, electrical contact is established
Data Source
AI summary
A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.