Flexible Circuit Board Shielding for OLED Drive EMI
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
OLED display apparatuses face decreased drive yield due to electromagnetic interference generated by drive IC and MFPC, which are not effectively shielded from both internal and external interference.
Innovation Solution
A flexible circuit board assembly with a wave absorbing layer and conductive fabric layer provides electromagnetic shielding, covering components and preventing external interference, while an insulating film layer prevents direct bonding and electrostatic discharge risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If Drive IC and MFPC are bound with OLED display module for circuit drive, then drive function is achieved, but electromagnetic interference is generated and drive yield decreases
Solution Approach 1:
A wave absorbing layer is introduced as an intermediary between the Drive IC/MFPC and the external environment. This layer absorbs electromagnetic interference signals before they can affect the drive components, thereby protecting the drive yield while maintaining the necessary circuit drive function.
Solution Approach 2:
The wave absorbing layer converts harmful electromagnetic interference into absorbed energy, transforming the harmful electromagnetic signals into heat or other forms of energy that do not interfere with the drive circuit operation, thus protecting the drive yield.
2Object-affected harmful factors
If wave absorbing layer is added to cover components for electromagnetic shielding, then electromagnetic protection is improved, but device complexity increases
Solution Approach 1:
The wave absorbing layer is implemented as a thin film structure that can be directly applied to the flexible circuit board. This thin film approach provides effective electromagnetic shielding while maintaining the flexibility and compactness of the display module, avoiding the need for bulky shielding structures.
Solution Approach 2:
The wave absorbing layer is formed using composite materials that combine electromagnetic absorbing properties with flexibility requirements. This allows the shielding layer to be integrated into the flexible circuit board structure without significantly increasing device complexity or compromising flexibility.
3Object-affected harmful factors
If conductive fabric layer is added to cover wave absorbing layer for enhanced shielding, then electromagnetic protection is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive fabric layer is bonded to the flexible circuit board at its edges, merging the shielding function with the existing board structure. This approach provides enhanced electromagnetic protection while avoiding the need for complex multi-step manufacturing processes, as the fabric layer can be integrated during standard assembly operations.
4Reliability
If insulating film layer is added between wave absorbing layer and flexible circuit board to prevent direct bonding, then electrostatic discharge protection is improved, but device complexity increases
Solution Approach 1:
The insulating film layer is implemented as a thin flexible film that prevents direct bonding between the wave absorbing layer and the flexible circuit board. This thin film structure provides electrostatic discharge protection while maintaining flexibility and not significantly increasing the overall device complexity or thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields components from electromagnetic interference, enhancing electromagnetic protection and preventing adverse effects on the flexible circuit board, thereby improving the drive yield of OLED display apparatuses.
Implementation Method 1
a first wave absorbing layer, disposed on a side of the device part and configured to cover the components
Implementation Method 2
a conductive fabric layer, disposed on a side of the first wave absorbing layer facing away from the first flexible circuit board, and configured to cover the first wave absorbing layer
Data Source
AI summary
Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.