Flex Circuit Memory Module Footprint Reduction
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Solution Overview
Problem
Current technologies are inadequate for combining integrated circuit modules with both leaded packages and semiconductor die in a compact footprint, particularly for applications requiring flash memory and controller logic, as existing methods either do not optimize for leaded devices or result in increased footprint and thickness.
Innovation Solution
The use of flex circuitry to connect a leaded packaged IC, such as a flash memory device, to a semiconductor die, like a controller, where the leads of the IC contact the flex circuit directly or indirectly, allowing for a compact module configuration with various contact configurations and potential recessing of the die for reduced profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If leaded packaged IC and semiconductor die are combined using conventional stacking techniques, then connectivity between devices is achieved, but footprint and thickness increase substantially
Solution Approach 1:
The patent transitions from conventional planar or vertical stacking to a bent/folded flex circuit configuration that utilizes three-dimensional spatial arrangement. The flex circuit is bent at an angle (e.g., 45 degrees) to position the leaded IC and die in a compact modular layout, effectively using dimensional transformation to reduce overall footprint while maintaining device connectivity.
Solution Approach 2:
The patent implements a nested arrangement where the die is positioned within or adjacent to the leaded IC package structure. The flex circuit connects these components in a space-efficient configuration where smaller components are integrated within the envelope of larger components, reducing the total module footprint through nested spatial organization.
2Adaptability or versatility
If multiple devices are stacked to provide memory and controller functionality, then functional requirements are met, but module thickness increases
Solution Approach 1:
The patent employs a flexible circuit board that can be bent and folded into different configurations. This dynamic flexibility allows the same flex circuit to accommodate various device combinations (memory ICs, controllers, buffers) while maintaining a compact thickness profile, as the flex circuit adapts its shape rather than requiring additional vertical stacking space.
Solution Approach 2:
Instead of stacking devices vertically which increases thickness, the patent uses a bent flex circuit configuration that spreads components out in a lateral arrangement with optimized spacing. The angular bend in the flex circuit creates a compact three-dimensional layout that provides full memory controller functionality while minimizing the z-axis thickness of the final module.
3Area of stationary object
If chip-scale packaged devices are used, then footprint is reduced, but compatibility with leaded device stacking techniques is lost
Solution Approach 1:
The patent creates a universal mounting platform using the flex circuit that can accommodate both leaded packaged ICs and chip-scale devices. The flex circuit serves multiple functions: it provides mechanical support, electrical connectivity, and spatial positioning for different device types. This universal interface allows the same base structure to work with various package technologies without requiring specialized stacking techniques for each device type.
Data Source
AI summary
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.