Flex Circuit Memory Module for Compact Footprint
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Solution Overview
Problem
Current technologies are inadequate for combining integrated circuit modules with both leaded packages and semiconductor die in a compact footprint, particularly for applications requiring flash memory and controller logic, as existing methods either do not optimize for leaded devices or result in increased footprint and thickness.
Innovation Solution
The use of flex circuitry to connect a leaded packaged IC, such as a flash memory device, to a semiconductor die, like a controller, where the leads of the IC contact the flex circuit directly or indirectly, allowing for a compact module configuration with various contact configurations and potential recessing of the die for reduced profile.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flash memory and controller logic are implemented as separate packaged devices, then compatibility with memory subsystem interfaces is improved, but the application footprint and module thickness increase substantially
Solution Approach 1:
The patent combines flash memory and controller logic into a single integrated circuit device, merging two previously separate packaged devices into one unified component. This integration maintains interface compatibility while substantially reducing the application footprint and module thickness that would result from using multiple separate devices.
Solution Approach 2:
The controller logic is embedded within or alongside the flash memory die in a nested configuration, where one functional element is incorporated into the structure of the other. This nesting approach allows both components to coexist in a compact arrangement that preserves interface compatibility while minimizing the overall footprint.
2Ease of manufacture
If leaded packaged ICs are stacked using conventional techniques, then ease of manufacture is improved, but the techniques are not optimum for leaded devices and increase footprint
Solution Approach 1:
The patent transitions from lateral stacking arrangements to a vertical stacking configuration, utilizing the thickness dimension to accommodate multiple leaded packaged ICs. This vertical arrangement in the Z-dimension reduces the footprint in the X-Y plane while maintaining ease of manufacture through standardized stacking processes.
Solution Approach 2:
The use of thin film interconnect structures enables compact vertical stacking of leaded packaged ICs. These thin film connections allow for dense vertical integration without substantially increasing the lateral footprint, while maintaining manufacturability through established thin film deposition and patterning techniques.
3Area of stationary object
If chip-scale packaged devices are stacked, then footprint is reduced, but the techniques are not suitable for leaded devices
Solution Approach 1:
The patent creates a universal stacking platform that can accommodate both chip-scale packaged devices and leaded packaged ICs using the same vertical stacking methodology. This multi-functional approach allows the system to handle different package types (CSP and leaded) with compatible processes, enabling footprint reduction while maintaining versatility across device types.
Data Source
AI summary
The present invention provides a system and method for combining a leaded package IC and a semiconductor die using a flex circuitry to reduce footprint for the combination. A leaded IC package is disposed along the obverse side of a flex circuit. In a preferred embodiment, leads of the leaded IC package are configured to allow the lower surface of the body of the leaded IC package to contact the surface of the flex circuitry either directly or indirectly through an adhesive. A semiconductor die is connected to the reverse side of the flex circuit. In one embodiment, the semiconductor die is disposed on the reverse side of the flex while, in an alternative embodiment, the semiconductor die is disposed into a window in the flex circuit to rest directly or indirectly upon the body of the leaded IC package. Module contacts are provided in a variety of configurations. In a preferred embodiment, the leaded IC package is a flash memory and the semiconductor die is a controller.