Flexible Circuit Board Pressure Transfer for Reliable PCB Bonding

The patent divides the binding terminals into two types: first-type binding terminals directly connected to first wirings, and second-type binding terminals connected to second wirings. This segmentation allows independent optimization of each terminal type's position and connection, resolving the misalignment issue while maintaining the double-row design for increased terminal quantity.

The patent introduces second wirings as intermediary elements that connect second-type binding terminals to the first wirings. These second wirings act as mediators that can be independently routed and positioned, allowing the binding terminals to be arranged in a double-row configuration without causing misalignment during bonding, thus solving both the quantity and precision requirements.

The patent performs preliminary positioning and alignment of the binding terminals and wirings before the bonding process. By pre-establishing the correct spatial relationship between first-type and second-type binding terminals and their corresponding wirings, the design prevents misalignment during high-temperature hot-pressing bonding, ensuring both strong bonding strength and reliable bonding impedance.

The patent applies different connection configurations to different regions: first-type binding terminals are directly connected to first wirings in one region, while second-type binding terminals are connected via second wirings in another region. This local differentiation allows each region to be optimized for its specific function, preventing side pressure inclination while maintaining overall bonding strength and reliability.