Flexible Circuit Board With Trench Shielding for High-Frequency Signals
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Solution Overview
Problem
Existing electromagnetic shielding methods for high-frequency transmission in wireless communication antennas and transmission wires are inadequate, limiting both shielding effectiveness and circuit layout flexibility.
Innovation Solution
A flexible circuit board design featuring an insulation substrate with trenches and conductive layers extending into these trenches, connected by conductive structures and power layers, forming a full-shielding electromagnetic shielding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive vias are disposed between circuit layers for electromagnetic shielding, then shielding effect is improved, but circuit layout flexibility is limited
Solution Approach 1:
The patent transitions from two-dimensional planar shielding (conductive vias between layers) to three-dimensional wraparound shielding (conductive layers extending along side surfaces and into trenches). This dimensional expansion enables comprehensive electromagnetic shielding while preserving circuit layout flexibility on the main circuit layers.
Solution Approach 2:
The conductive layers are nested within trenches formed in the insulation substrate, creating a nested structure where the conductive shielding layers are embedded within the substrate's recessed regions. This nesting approach provides effective shielding without adding external bulk or constraining circuit layer layouts.
2Reliability
If conventional electromagnetic shielding methods are used, then shielding for specific frequency ranges is achieved, but high-frequency signals above 50 GHz are still affected
Solution Approach 1:
The patent employs composite shielding structures combining multiple conductive layers, insulation materials with specific dielectric properties, and trench configurations. This composite approach creates a multi-layered electromagnetic barrier that effectively attenuates high-frequency signals above 50 GHz while maintaining signal transmission reliability.
Solution Approach 2:
The shielding structure is segmented into multiple conductive layers distributed across different circuit layers and along side surfaces, with insulation material filling the trenches between them. This segmentation creates multiple shielding barriers that collectively enhance high-frequency signal protection.
Data Source
AI summary
A flexible circuit board and a method for fabricating the same are provided. The flexible circuit board includes an insulation substrate with two trenches on its two opposite end surfaces separately. A signal wire is disposed in the insulation substrate, and thus the insulation substrate surrounds the signal wire. Two flexible circuit substrates are separately located on two opposite surfaces of the insulation substrate, and each flexible circuit substrate includes a conductive layer and a power layer. The conductive layer is extended from one surface to end surfaces of the insulation substrate, and then is extended to the trenches along the end surfaces. The power layer is located between the conductive layer and the insulation substrate and is electrically connected to the conductive layer. In each trench, one conductive layer is connected to the other conductive layer, and two conductive layers are electrically connected to each other.