Flex-Circuit Vibration Isolator With Integrated Signal Paths
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Solution Overview
Problem
Conventional vibration isolators are complex, heavy, large, expensive, and unreliable, and often require separate cables for electrical connectivity, which is not suitable for lightweight devices like IC chips and MEMS devices, and they fail to effectively isolate dynamic mechanical inputs like shock and vibration.
Innovation Solution
The use of flex circuits with insulating polymer layers and patterned conductive layers to provide both mechanical support and integrated electrically isolated conductive paths, allowing for the isolation of dynamic mechanical inputs while enabling electrical connectivity for lightweight devices, with the flex circuits being easy to produce in large quantities at low cost and offering standardized performance characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional vibration isolators (coil springs, elastomeric pads, wire ropes) are used, then mechanical isolation from vibration and shock is achieved, but the device becomes complex, heavy, large, expensive, and unreliable
Solution Approach 1:
The patent combines mechanical vibration isolation and electrical connectivity functions into a single integrated flex circuit structure. The flex circuit serves dual purposes: providing mechanical support and isolation through its flexible curved paths, while simultaneously providing electrical connections through embedded conductive traces, eliminating the need for separate cables or wiring harnesses.
Solution Approach 2:
The flex circuit is designed to perform multiple functions simultaneously: it acts as a mechanical suspension element for vibration isolation, provides electrical connectivity through integrated conductive paths, and offers structural support for the supported circuit. This multi-functionality reduces overall system complexity and component count.
2Ease of operation
If separate cables or wiring harnesses are used for electrical connectivity, then electrical power and signals are transmitted, but the device becomes heavier and more complex, which is not suitable for lightweight devices like IC chips and MEMS
Solution Approach 1:
The patent merges the electrical connectivity function into the vibration isolation structure itself. The conductive traces are embedded within the flex circuit layers, which also provide mechanical isolation. This integration eliminates separate cables and reduces overall device weight while maintaining electrical connectivity for lightweight devices.
3Object-affected harmful factors
If conventional vibration isolators are used, then mechanical isolation is provided, but they fail to effectively isolate dynamic mechanical inputs like shock and vibration at critical frequencies
Solution Approach 1:
The flex circuit is designed with flexible curved paths that can dynamically deform in response to vibration and shock inputs. The curved geometry allows the structure to flex and absorb mechanical energy, providing effective isolation of dynamic mechanical inputs while maintaining electrical connectivity through the flexible conductive traces.
4Adaptability or versatility
If multiple separate components are used for vibration isolation and electrical connectivity, then both functions are achieved, but manufacturing becomes more complex and costly
Solution Approach 1:
The patent combines multiple separate components (vibration isolator and electrical connector) into a single integrated flex circuit assembly. The conductive traces are formed as part of the flex circuit structure during manufacturing, eliminating the need for separate assembly steps and reducing manufacturing complexity and cost while maintaining both vibration isolation and electrical connectivity functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively isolates lightweight devices from shock and vibration, providing multiple electrically isolated conductive paths and attenuating critical frequencies above the isolation frequency, thus protecting sensitive equipment from damage and performance degradation.
Implementation Method 1
the flex circuits extend between the support structure and opposing sides of the platform in at least partly curved paths to provide at least two opposing bends to support the platform and provide attenuation of dynamic mechanical inputs (e.g., shock and vibration) at frequencies above an isolation frequency
Implementation Method 2
The flex circuits also provide multiple electrically isolated conductive paths between the support structure and the supported circuit that carry power or at least one signal to or from the supported circuit
Data Source
AI summary
A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.