Flex Clip Connector for Semiconductor Die Alignment
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Solution Overview
Problem
Existing semiconductor die packages using rigid clip structures require precise horizontal alignment and involve additional processing steps like laser cutting, which can increase assembly time and are limited to single die configurations.
Innovation Solution
The use of a flex clip connector with a flexible insulator and conductive traces that can be pre-formed to attach a semiconductor die to a leadframe structure, allowing for easier alignment and assembly, and can accommodate multiple dies, reducing processing steps and increasing throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a rigid clip structure is used to connect source and gate regions, then the electrical connection is stable, but the horizontal alignment precision requirement increases and rework is needed when misalignment occurs
Solution Approach 1:
The patent applies the dynamics principle by transitioning from a rigid clip structure to a flexible clip structure. The flexible clip can dynamically adjust its shape and position to accommodate misalignment between the source and gate regions, while still maintaining stable electrical connection. This dynamic flexibility resolves the contradiction by allowing the connector to adapt to manufacturing variations without requiring high precision alignment.
Solution Approach 2:
The patent applies parameter changes by modifying the physical properties of the clip structure from rigid to flexible. This change in the flexibility parameter allows the clip to deform and conform to the actual positions of the contact regions, thereby maintaining reliable electrical connection even when horizontal alignment is not precise.
2Strength
If a rigid clip structure with tie bar is used, then the connection strength is sufficient, but the processing time increases due to additional laser cutting step
Solution Approach 1:
The patent applies the extraction principle by removing the tie bar component and the laser cutting step from the manufacturing process. The flexible clip structure is designed to be formed as a single piece or pre-assembled unit that attaches to both source and gate regions simultaneously, eliminating the need for subsequent separation operations. This extraction of unnecessary steps reduces processing time while maintaining connection strength through the flexible clip's design.
3Reliability
If a rigid clip structure is used, then the electrical connection is reliable, but the adaptability to different die configurations is limited to single die only
Solution Approach 1:
The patent applies the universality principle by designing a flexible clip structure that can adapt to multiple die configurations, including single die and multi-die arrangements. The flexible nature of the clip allows it to be configured for different package types (e.g., power packages, RF packages) and die layouts, making it a universal connector that maintains reliable electrical connection across various applications without requiring design changes.
Data Source
AI summary
A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure.