Flexible Circuit Connector Layout for Impedance and Attenuation Control
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Solution Overview
Problem
Conventional connectors for flexible circuit boards suffer from poor impedance control and signal attenuation during high frequency signal transmission, primarily due to inadequate design and material properties, which affect the quality and stability of signal transmission.
Innovation Solution
A high frequency signal connector with impedance control and attenuation reduction, featuring a connection base and circuit board with conductive, insulation, and shielding layers, where the characteristic impedance and attenuation are managed through line width, thickness, pitch, insulation layer thickness, and shielding layer distance, along with a grounding function to reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metallic spring plates are used for circuit connection, then signal transmission function is realized, but impedance control capability is lost
Solution Approach 1:
The patent employs composite material structures in the connector design, combining different materials with complementary properties. The connection circuit board uses layered composite structures including conductive layers, insulation layers, and shielding layers, each made from materials optimized for their specific function. This composite approach enables simultaneous achievement of signal transmission reliability and precise impedance control that single-material spring plates cannot provide.
Solution Approach 2:
The patent systematically controls impedance parameters through precise adjustment of geometric dimensions and material properties. The connection circuit board design specifies exact parameters including conductor line width, line thickness, line pitch, insulation layer thickness, and distances to shielding layers. By controlling these parameters within specific ranges, the patent achieves characteristic impedance control for high frequency signals while maintaining signal transmission functionality.
2Ease of operation
If conventional connector structure is used, then connection function is achieved, but signal attenuation occurs during high frequency transmission
Solution Approach 1:
The patent introduces intermediary elements to reduce signal attenuation. The connection circuit board acts as an intermediary structure between the connection base and the flexible circuit board, providing controlled impedance pathways and shielding. The shielding layers serve as intermediary protective elements that block electromagnetic interference and reduce signal loss during high frequency transmission, while the overall structure maintains ease of connection.
Solution Approach 2:
The patent transitions from two-dimensional spring plate contacts to a three-dimensional layered circuit board structure. This dimensional change allows for multiple functional layers (conductive, insulation, shielding) to be stacked vertically, creating controlled impedance pathways that reduce signal attenuation. The multi-layer construction provides additional spatial dimensions for signal routing and electromagnetic field management, reducing energy loss during transmission.
3Ease of manufacture
If simple connector design is used, then manufacturing is easier, but impedance control and signal quality deteriorate
Solution Approach 1:
The patent divides the connector into segmented functional modules: connection base, connection circuit board, flexible circuit board, grounding conductive line, and shielding layers. Each segment has specific manufacturing requirements and functions. The connection circuit board is further segmented into multiple layers (conductive, insulation, shielding) that can be manufactured and assembled separately. This segmentation allows for standardized manufacturing processes for each component while achieving precise overall impedance control through the integrated design of all segments.
Data Source
AI summary
A high frequency signal connector with impedance control and attenuation reduction for a flexible circuit board includes a connection base and a connection circuit board. The connection circuit board is at least partly disposed in the connection base and has at least one contact end corresponding to a socket end of the connection base. The characteristic impedance and attenuation reduction characteristic of a high frequency signal transmitting through a signal transmission path of an electrically conductive layer of the connection circuit board are determined by a conductor line width, line thickness, conductive material, conductive property of the signal transmission path, and line pitch between two adjacent signal transmission paths; thicknesses and material characteristic constants of an insulation layers of the connection circuit board; distances of the signal transmission path relative to a shielding layers (or grounding layers) of the connection circuit board; and conductivity of the shielding layers.