Compact Proximity Sensor Flex Connector Assembly
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Solution Overview
Problem
Conventional proximity sensors in portable devices face inaccuracies due to oil smudges and smudges on the outer surface, and the compact size of these devices poses challenges in assembly without damaging components, necessitating a high-yield assembly process for small form factor devices.
Innovation Solution
A flex connector assembly with a main body portion, a support structure including a rigid back support plate, and a conformal coating of resilient material is used to connect electrical components, allowing for a compact folded arrangement that reduces the risk of damaging traces during assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional assembly techniques are used to assemble proximity sensors in compact arrangements, then assembly process is simple, but components are at high risk of damage
Solution Approach 1:
A conformal coating of resilient material is applied to the flex connector assembly before assembly operations. This coating acts as a cushion that absorbs and distributes bending forces during folding operations, preventing damage to the traces and components while maintaining a straightforward assembly process
Solution Approach 2:
The flex connector assembly uses a flexible printed circuit board with thin film traces that can be folded into compact arrangements. The flexibility of this thin film structure allows for compact component placement while the conformal coating provides protective cushioning during the folding process
2Area of stationary object
If the flex connector is folded into a compact arrangement, then device footprint is reduced, but traces may be damaged during folding
Solution Approach 1:
The conformal coating of resilient material is applied beforehand to protect the traces during the folding operation. This cushioning layer distributes the bending stresses and prevents trace damage while allowing the flex connector to achieve the compact folded arrangement needed for small device footprint
3Volume of moving object
If proximity sensor components are placed in close proximity, then device size is reduced, but assembly yield decreases due to component damage risk
Solution Approach 1:
The resilient conformal coating is applied before assembly to protect components during close-proximity placement. This cushioning prevents damage that would otherwise occur during high-density component assembly, thereby maintaining high assembly yield while achieving compact device size
Solution Approach 2:
The flexible connector assembly allows components to be placed in close proximity by folding the flexible circuit board into a compact configuration. The flexibility enables high component density while the conformal coating ensures damage-free assembly, maintaining both compact size and high assembly yield
Data Source
AI summary
A compact proximity sensor for use in a portable computing device is described. In particular various embodiments of a proximity sensor which fits in an extremely small portion of a cellular phone, and accurately determine the presence of a user's head in close proximity to a surface of the cellular phone. In particular, a high yield assembly process for installing the compact proximity sensor is described.