Rigid-Flexible Substrate Structure for Thermal Strain Relief
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Solution Overview
Problem
As semiconductor packages increase in size to meet the demands of super high performance computing (super-HPC) applications, their reliability at the component and board levels is compromised due to increased strain and thermal expansion differences.
Innovation Solution
A semiconductor package structure is developed using a rigid-flexible substrate with a flexible core penetrating through rigid structures, allowing for reduced strain on electrical connectors and improved reliability by partial contact with the package structure, and utilizing a redistribution layer and interconnection structures to enhance signal paths and reduce insertion loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the semiconductor package size is increased to meet super-HPC demands, then the data rate and bandwidth are improved, but the reliability at component and board levels deteriorates due to increased strain and thermal expansion differences
Solution Approach 1:
The substrate is divided into rigid portions and flexible portions, with the flexible portion acting as a buffer zone that can deform independently to absorb thermal expansion stresses, while the rigid portions maintain structural integrity and electrical connectivity for high-speed data transmission
Solution Approach 2:
The substrate combines rigid materials (for structural support and signal integrity) with flexible materials (for stress absorption and thermal expansion accommodation), creating a composite structure that simultaneously achieves high data rate transmission and improved reliability in large-scale packages
2Productivity
If the semiconductor package size is increased, then the bandwidth is improved, but the reliability at board level deteriorates due to thermal expansion differences
Solution Approach 1:
The substrate's mechanical properties are changed by varying the flexibility parameter across different regions, allowing the board-level structure to accommodate thermal expansion differences through controlled deformation of flexible portions while maintaining electrical performance for high bandwidth applications
3Manufacturing precision
If a rigid substrate is used to maintain structural integrity, then the manufacturing precision is improved, but the strain on electrical connectors increases reducing reliability
Solution Approach 1:
The substrate is segmented into rigid regions that provide manufacturing precision and structural integrity, and flexible regions that reduce strain on electrical connectors by deforming under thermal stress, thereby maintaining connector reliability in large-scale packages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of large-scale semiconductor packages by reducing strain on connectors and thermal expansion-induced stress, while shortening signal paths and minimizing insertion loss, particularly beneficial for super-HPC applications.
Implementation Method 1
reliability of the semiconductor package at a component level or a board level may be compromised due to increased strain and thermal expansion differences
Implementation Method 2
A semiconductor package structure is developed using a rigid-flexible substrate with a flexible core penetrating through rigid structures, allowing for reduced strain on electrical connectors
Implementation Method 3
utilizing a redistribution layer and interconnection structures to enhance signal paths and reduce insertion loss
Data Source
AI summary
A manufacturing method of a semiconductor package is provided. The method includes: providing an initial rigid-flexible substrate, wherein the initial rigid-flexible substrate includes rigid structures and a flexible core laterally penetrating through the rigid structures, and further includes a supporting frame connected to the rigid structures; bonding a package structure onto the initial rigid-flexible substrate, wherein the package structure includes semiconductor dies and an encapsulant laterally surrounding the semiconductor dies; and removing the supporting frame.