Flex Integrated Antenna Array for Compact MMW Devices

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Solution Overview

Problem

The increasing complexity and dimensions of millimeter-wave (MMW) modules in wireless devices due to high-frequency RF frequencies pose constraints on the form factor, making it challenging to maintain a compact design while supporting wideband antennas and signal routing.

Innovation Solution

The design decouples the MMW module into a low-loss flex cable assembly and antenna carriers, using a ball grid array for structural support and antenna alignment, allowing for dual-polar MMW arrays to be placed at the edges of the device, thereby reducing the overall thickness and maintaining compactness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a separate MMW module is used to support high-frequency RF signals and wideband antennas, then antenna performance and signal routing are improved, but device thickness and form factor increase

Engineering Contradiction:
Improveantenna performanceVSAvoiddevice thickness
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent integrates the radiators directly into the device cover, merging the antenna function with the housing structure. This eliminates the need for a separate MMW module while maintaining antenna performance, thereby reducing device thickness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The device cover serves dual purposes: it provides structural protection and houses the radiator elements for MMW communication. This multi-functionality reduces the number of separate components needed, contributing to a thinner device profile.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Power

If larger processing circuits are used to generate and control high-frequency RF signals, then signal processing capability is improved, but circuit dimensions and device complexity increase

Engineering Contradiction:
Improvesignal processing capabilityVSAvoidcircuit dimensions
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent extracts the radiator elements from the main circuit board and integrates them into the device cover. This separation allows the processing circuits to be optimized for high-frequency operation while the radiators are positioned independently, reducing overall device complexity and dimensions.

Inventive Principle:
Principle #2Taking out (Extraction)

3Length of stationary object

If radiators are integrated into the device cover, then device thickness is reduced, but structural coupling and alignment precision become more challenging

Engineering Contradiction:
Improvedevice thicknessVSAvoidantenna alignment
Core Design Contradiction:
Length of stationary objectVSManufacturing precision

Solution Approach 1:

The patent incorporates alignment features directly into the device cover structure during manufacturing. These pre-built alignment mechanisms ensure precise positioning of the radiator elements relative to the feed lines, eliminating the need for post-assembly adjustments and ensuring manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11165136B2Flex integrated antenna array
Publication Date: 2021.11.02 QUALCOMM INC
  • US11165136B2 patent drawing
  • US11165136B2 patent drawing
  • US11165136B2 patent drawing

AI summary

Techniques are discussed herein for improving the form factor of a wideband antenna in a mobile device. An example of a wireless device according to the disclosure includes at least one radio frequency integrated circuit, a flex cable assembly operably coupled to the at least one radio frequency integrated circuit, and at least one radiator operably coupled to the flex cable assembly via at least one conductor in a ball grid array.