Implantable Device Flex Interconnect Strain Relief

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Solution Overview

Problem

The interconnects between modular components in implantable medical devices often face reliability and manufacturability issues due to stress/strain from static or cyclic loading, which can impact the reliability of electrical connectors and associated connections.

Innovation Solution

Incorporating a flex circuit connector with a strain relief section, such as a C-shaped portion with a gap, to provide relief in multiple dimensions, and using methods like laser cutting to create the strain relief structure, which can absorb motion and distribute forces across multiple directions, thereby reducing strain on pins and connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If modular electronic designs are used in implantable medical devices, then device economy, reliability and size are improved, but stress/strain on electrical connectors and associated connections increases

Engineering Contradiction:

Improvedevice reliabilityVSAvoidstress/strain on electrical connectors

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The connector is divided into multiple regions (first region, second region, strain relief section) with distinct functions. The strain relief section is segmented as a separate C-shaped portion that can independently deform to absorb stress, while the first and second regions maintain electrical connections. This segmentation allows the connector to handle stress without compromising electrical connectivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The strain relief section acts as an intermediary element between the rigid connector regions and the connection areas. It serves as a mechanical buffer that absorbs and distributes stress, protecting the electrical connectors from direct strain while maintaining the modular design benefits.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Volume of moving object

If close fitting modular electronic designs are used, then device compactness is improved, but manufacturability and reliability of interconnects deteriorate

Engineering Contradiction:

Improvedevice volumeVSAvoidmanufacturability of interconnects

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The strain relief section is implemented as a flexible C-shaped portion that can be integrated into the flex circuit. This flexible structure allows for compact device packaging while providing necessary strain relief, and can be manufactured using standard flex circuit fabrication processes including laser cutting to create the C-shaped geometry.

Inventive Principle:

Principle #30Flexible shells and thin films

3Stability of the object's composition

If static or cyclic loading is applied to modular components, then device operational stability is maintained, but reliability of electrical connectors decreases

Engineering Contradiction:

Improveoperational stabilityVSAvoidreliability of electrical connectors

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The strain relief section is designed as a dynamic element that can deform elastically under static or cyclic loading conditions. The C-shaped geometry allows the section to flex and absorb mechanical stress, converting mechanical energy into elastic deformation rather than transmitting it to the electrical connectors. This dynamic response maintains connector reliability during operational stability requirements.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS11247060B2Implantable medical devices with flexible interconnect having strain relief

Publication Date: 2022.02.15 CARDIAC PACEMAKERS INC

AI summary

Implantable medical devices including interconnections having strain-relief structure. The interconnections can take the form of flexible circuits. Strain relief gaps and shapes are integrated in the interconnections to relieve forces in each of three dimensions. In some examples, the region of an interconnection which couples with a component of the implantable medical device is separated by a strain relief gap from a connection to a second component and/or a location where the flex bends around a corner.